Umngundo wegraphite/Jigs/ulungiselelo lweSemiconductor Encapsulations ngokutywinwa kweGlass-to-Metal

Umngundo wegraphite/Jigs/ulungiselelo lweSemiconductor Encapsulations ngokutywinwa kweGlass-to-Metal

Iimpawu zokubumba zethu zegraphite:

1. I-graphite molds yenye yezona zinto zikwazi ukumelana nobushushu okwangoku.

2. Ngokuxhathisa ukothuka kwe-thermal, akukho zintanda ziya kwenzeka xa ubushushu bushushu kwaye bubanda

3. Ukugqwesa kwe-thermal conductivity kunye neempawu zokuqhuba

4. Ukuthambisa okulungileyo kunye nokuxhathisa i-abrasion

5. Uzinzo lwekhemikhali, ukuxhathisa kwe-asidi kunye ne-alkali kunye nokumelana nomhlwa, akukho lula ukusabela ngobuninzi besinyithi.

6. Ubonelelo lwefektri elungiselelwe igraphite sintering mold Kulula ukusetyenzwa, ukusebenza kakuhle koomatshini, kunokwenza imilo entsonkothileyo kunye nokungunda okuchanekileyo.
Isicelo

Ukungunda kwegraphite kusetyenziswe ngokubanzi kule miba ilandelayo:

1.Ukubunjwa ngokuqhubekayo

2.Pressure Foundry mold

3.Glass ukubumba kunye die

4.Sintering ngundo

5.Centrifugal casting mold

6.Nyibilikisa igolide, isilivere, izacholo……