SiC Wafer Boat / Tower

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SehlahisoaDngodiso

Silicon carbide Wafer Boat e sebelisoa haholo joalo ka sets'oants'o sa liphaephe ts'ebetsong ea phallo ea mocheso o phahameng.

Melemo:

Ho hanyetsa mocheso o phahameng:tšebeliso e tloaelehileng ho 1800 ℃

Boima bo phahameng ba mocheso:e lekanang le thepa ea graphite

Boima bo phahameng:boima ba bobeli ho daemane, boron nitride

Khanyetso ea kutu:asiti e matla le alkali ha e na kutu ho eona, ho hanyetsa kutu ho molemo ho feta tungsten carbide le alumina.

Boima bo bobebe:boima bo tlase, bo haufi le aluminium

Ha ho deformation: coefficient e tlase ea katoloso ea mocheso

Ho hanyetsa mocheso oa mocheso:e khona ho mamella liphetoho tse matla tsa mocheso, e hanela ts'oaetso ea mocheso, 'me e na le ts'ebetso e tsitsitseng

Thepa ea 'Mele ea SiC

Thepa	Boleng	Mokhoa
Botenya	3.21 g/cc	Sink-float le dimension
Mocheso o khethehileng	0.66 J/g °K	Pulsed laser flash
Matla a flexural	450 MPa560 MPa	4 ntlha e kobehang, RT4 ntlha e kobehang, 1300 °
Ho robeha ho thata	2,94 MPa m1/2	Microindentation
Ho thatafala	2800	Vicker's, boima ba 500g
Elastic ModulusYoung's Modulus	450 GPA430 GPA	4 pt koba, RT4 pt kobeha, 1300 °C
Boholo ba lijo-thollo	2 - 10 µm	SEM

Thermal Properties of SiC

Thermal Conductivity	250 W/m °K	Mokhoa oa laser flash, RT
Katoloso ea Thermal (CTE)	4.5 x 10-6 °K	Mocheso oa kamore ho fihlela ho 950 °C, dilatometer ea silika