SiC Coating Carrier Bakeng sa RTP/RTA ke karolo ea bohlokoa e sebelisoang mekhoeng ea tlhahiso ea semiconductor e bitsoang Rapid Thermal Processing & Annealing, re sebelisa theknoloji ea rona e nang le tokelo ea molao ho etsa sepalangoang sa silicon carbide se nang le bohloeki bo phahameng ka ho fetisisa, ho apara ka mokhoa o ts'oanang hantle le bophelo bo botle ba tšebeletso, joalo ka. hammoho le ho hanyetsa lik'hemik'hale tse phahameng le thepa ea botsitso ba mocheso.
Likarolo tsa lihlahisoa tsa rona:
1. Ho hanyetsa mocheso o phahameng oa oxidation ho fihlela ho 1700 ℃.
2. Bohloeki bo phahameng le ho tšoana ha mocheso
3. Ho hanyetsa kutu e ntle haholo: acid, alkali, letsoai le li-reagents tsa manyolo.
4. Boima bo phahameng, bokaholimo bo kopanetsoeng, likaroloana tse ntle.
5. Bophelo bo bolelele ba tšebeletso le bo tšoarellang haholoanyane
CVD SiC薄膜基本物理性能 Lintho tsa motheo tsa 'mele tsa CVD SiCho roala | |
性质 / Thepa | 典型数值 / Boleng bo Tlwaelehileng |
晶体结构 / Sebopeho sa Crystal | FCC mohato oa β多晶,主要為(111)取向 |
密度 / Ho teteana | 3.21 g/cm³ |
硬度 / Ho thatafala | 2500 维氏硬度 (moroalo oa 500g) |
晶粒大小 / Mabele SiZe | 2 ~ 10μm |
纯度 / Bohloeki ba lik'hemik'hale | 99.99995% |
热容 / Bokhoni ba mocheso | 640 J·kg-1·K-1 |
升华温度 / Sublimation Mocheso | 2700 ℃ |
抗弯强度 / Flexural Matla | 415 MPa RT 4-ntlha |
杨氏模量 / Young's Modulus | 430 Gpa 4pt kobeha, 1300 ℃ |
导热系数 / ThermalBoikhantšo | 300Wm-1·K-1 |
热膨胀系数 / Katoloso ea Mocheso(CTE) | 4.5×10-6K-1 |
VET Energy ke moetsi oa 'nete oa lihlahisoa tsa graphite le silicon carbide tse nang le liphahlo tse fapaneng tse kang SiC coating, TaC coating, glassy coating, pyrolytic carbon coating, joalo-joalo, e ka fana ka likarolo tse fapaneng tse hlophisitsoeng bakeng sa indasteri ea semiconductor le photovoltaic.
Sehlopha sa rona sa tekheniki se tsoa litsing tse phahameng tsa lipatlisiso tsa lapeng, se ka u fa litharollo tsa lisebelisoa tse eketsehileng bakeng sa hau.
Re ntse re tsoela pele ho nts'etsapele lits'ebetso tse tsoetseng pele ho fana ka lisebelisoa tse tsoetseng pele, 'me re entse theknoloji e ikhethileng e nang le tokelo ea molao, e ka etsang hore maqhama lipakeng tsa pente le substrate e tiee le hore e se ke ea oela habonolo.
Re u amohela ka mofuthu hore u etele feme ea rona, ha re buisaneng ka ho eketsehileng!