Mehloli ea tšilafalo le thibelo indastering ea tlhahiso ea semiconductor

Tlhahiso ea lisebelisoa tsa semiconductor haholo-holo e kenyelletsa lisebelisoa tsa discrete, li-circuits tse kopantsoeng le mekhoa ea tsona ea ho paka.
Tlhahiso ea semiconductor e ka aroloa ka mekhahlelo e meraro: tlhahiso ea thepa ea 'mele oa sehlahisoa, sehlahisoasephaphathatlhahiso le kopano ea lisebelisoa. Har'a tsona, tšilafalo e tebileng ka ho fetisisa ke sethala sa tlhahiso ea lihlahisoa.
Lintho tse silafatsang li arotsoe haholo ka metsi a litšila, khase e litšila le litšila tse tiileng.
Mokhoa oa ho etsa chip:
Sephaphatha sa siliconka mor'a ho sila ka ntle - ho hloekisa - oxidation - ho hanyetsa junifomo - photolithography - nts'etsopele - etching - diffusion, ion implantation - lik'hemik'hale tsa mouoane oa lik'hemik'hale - polishing ea lik'hemik'hale - metallization, joalo-joalo.

Metsi a litšila
Palo e kholo ea metsi a litšila a hlahisoa mohatong o mong le o mong oa ts'ebetso ea tlhahiso ea semiconductor le tlhahlobo ea ho paka, haholo metsi a litšila a nang le asiti, metsi a litšila a nang le ammonia le metsi a litšila a tlhaho.

1. Metsi a litšila a nang le Fluorine:
Hydrofluoric acid e fetoha mokelikeli o ka sehloohong o sebelisoang lits'ebetsong tsa oxidation le etching ka lebaka la thepa ea eona ea oxidizing le e senyang. Metsi a litšila a nang le fluorine ts'ebetsong haholo-holo a tsoa ts'ebetsong ea phallo le ts'ebetsong ea ho belisoa ka lik'hemik'hale ts'ebetsong ea tlhahiso ea chip. Ts'ebetsong ea ho hloekisa liphaphatha tsa silicon le lisebelisoa tse amanang le tsona, hydrochloric acid e boetse e sebelisoa hangata. Lits'ebetso tsena kaofela li phetheloa ka litanka tse inehetseng kapa lisebelisoa tsa ho hloekisa, kahoo metsi a litšila a nang le fluorine a ka ntšoa a le mong. Ho ea ka mahloriso, e ka aroloa ka metsi a litšila a nang le fluorine a mangata le metsi a litšila a nang le ammonia a tlaase. Ka kakaretso, metsi a litšila a nang le ammonia a mangata a ka fihla ho 100-1200 mg/L. Lik'hamphani tse ngata li sebelisa hape karolo ena ea metsi a litšila bakeng sa lits'ebetso tse sa hlokeng boleng bo phahameng ba metsi.
2. Metsi a litšila a nang le asiti:
Hoo e batlang e le ts'ebetso e 'ngoe le e' ngoe ea ts'ebetso e kopanetsoeng ea potoloho ea potoloho e hloka hore chip e hloekisoe. Hona joale, sulfuric acid le hydrogen peroxide ke metsi a hloekisang a sebelisoang ka ho fetisisa mosebetsing o kopanetsoeng oa potoloho ea potoloho. Ka nako e ts'oanang, li-reagents tsa acid-base tse kang nitric acid, hydrochloric acid le metsi a ammonia li sebelisoa hape.
Metsi a litšila a acid-base a ts'ebetso ea tlhahiso a tsoa haholo ts'ebetsong ea ho hloekisa ts'ebetsong ea tlhahiso ea li-chip. Ts'ebetsong ea ho paka, chip e tšoaroa ka tharollo ea acid-base nakong ea tlhahlobo ea electroplating le lik'hemik'hale. Ka mor'a phekolo, e hloka ho hlatsuoa ka metsi a hloekileng ho hlahisa metsi a litšila a nang le acid-base. Ntle le moo, li-reagents tsa acid-base tse kang sodium hydroxide le hydrochloric acid li boetse li sebelisoa seteisheneng sa metsi a hloekileng ho nchafatsa li-anion le li-resin tsa cation ho hlahisa metsi a litšila a nchafatsoang ke acid. Ho hlatsoa metsi a mohatla ho boetse ho hlahisoa nakong ea ts'ebetso ea ho hlatsoa khase ea acid-base. Lik'hamphaning tse kopaneng tsa tlhahiso ea potoloho, palo ea metsi a litšila a acid-base e kholo haholo.
3. Metsi a litšila:
Ka lebaka la mekhoa e fapaneng ea tlhahiso, palo ea li-solvents tse sebelisoang indastering ea semiconductor e fapane haholo. Leha ho le joalo, joalo ka li-agent tsa ho hloekisa, li-solvents tsa organic li ntse li sebelisoa haholo likhokahanong tse fapaneng tsa liphutheloana tsa tlhahiso. Litlhapi tse ling li fetoha ho tsoa ha metsi a litšila.
4. Metsi a mang a litšila:
Ts'ebetso ea tlhahiso ea semiconductor e tla sebelisa palo e kholo ea ammonia, fluorine le metsi a hloekileng haholo bakeng sa ho silafatsa, ka hona ho hlahisa ho tsoa ha metsi a litšila a nang le ammonia a mangata.
Ts'ebetso ea electroplating ea hlokahala molemong oa ho paka semiconductor. The chip e hloka ho hloekisoa ka mor'a electroplating, 'me metsi a litšila a hloekisang electroplating a tla hlahisoa ts'ebetsong ena. Kaha litšepe tse ling li sebelisoa ho electroplating, ho tla ba le likhase tsa ion tsa tšepe metsing a litšila a hloekisang a electroplating, joalo ka lead, tin, disc, zinki, aluminium, joalo-joalo.

Khase e litšila
Kaha ts'ebetso ea semiconductor e na le litlhoko tse phahameng haholo bakeng sa bohloeki ba phaposi ea ts'ebetso, libapali li atisa ho sebelisoa ho ntša mefuta e fapaneng ea likhase tsa litšila tse fetotsoeng nakong ea ts'ebetso. Ka hona, tlhahiso ea khase e litšila indastering ea semiconductor e tšoauoa ka bongata bo boholo ba mosi le khatello e tlase ea mosi. Ho ntšoa ha khase e litšila le hona ho fokotsehile haholo.
Mesi ena ea khase e litšila e ka aroloa haholo-holo ka mekhahlelo e mene: khase e nang le asiti, khase ea alkaline, khase ea litšila ea tlhaho le khase e chefo.
1. Khase ea litšila e nang le asiti:
Khase ea litšila tse nang le asiti hangata e tsoa ho phallo,CVD, CMP le mekhoa ea etching, e sebelisang tharollo ea ho hloekisa acid-base ho hloekisa sephaphatha.
Hajoale, sesebelisoa sa ho hloekisa se sebelisoang haholo molemong oa tlhahiso ea semiconductor ke motsoako oa hydrogen peroxide le sulfuric acid.
Khase ea litšila e hlahisoang lits'ebetsong tsena e kenyelletsa likhase tse nang le asiti tse kang sulfuric acid, hydrofluoric acid, hydrochloric acid, nitric acid le phosphoric acid, mme khase ea alkaline haholo-holo ke ammonia.
2. Khase ea litšila:
Khase ea litšila ea lintho tse phelang e tsoa haholo lits'ebetsong tse kang photolithography, nts'etsopele, etching le diffusion. Lits'ebetsong tsena, tharollo ea manyolo (joalo ka joala ea isopropyl) e sebelisetsoa ho hloekisa bokaholimo ba sephaphatha, 'me khase e litšila e hlahisoang ke volatilization ke e' ngoe ea mehloli ea khase ea litšila tsa tlhaho;
Ka nako e ts'oanang, photoresist (photoresist) e sebelisoang ts'ebetsong ea photolithography le etching e na le metsoako ea tlhaho e sa fetoheng, e kang butyl acetate, e fetohang sepakapakeng nakong ea ts'ebetso ea li-wafer, e leng mohloli o mong oa litšila tsa tlhaho.
3. Khase ea litšila e chefo:
Khase ea litšila e chefo haholo-holo e tsoa lits'ebetsong tse kang crystal epitaxy, etching e omileng le CVD. Lits'ebetsong tsena, mefuta e fapaneng ea likhase tse khethehileng tsa bohloeki bo phahameng li sebelisoa ho sebetsana le sephaphatha, joalo ka silicon (SiHj), phosphorus (PH3), carbon tetrachloride (CFJ), borane, boron trioxide, joalo-joalo. Likhase tse ling tse khethehileng li chefo, ho tsieleha le ho senya.
Ka nako e ts'oanang, ts'ebetsong e omeletseng le ho hloekisa ka mor'a hore ho behoe mouoane oa lik'hemik'hale ha ho etsoa semiconductor, ho hlokahala khase e ngata ea oxide e feletseng (PFCS), e kang NFS, C2F & CR, C3FS, CHF3, SF6, joalo-joalo. ho monya ka matla sebakeng sa khanya ea infrared 'me u lule sepakapakeng nako e telele. Ka kakaretso li nkoa e le mohloli o ka sehloohong oa phello ea lefats'e ea greenhouse.
4. Ts'ebetso ea ho paka litšila tsa khase:
Ha ho bapisoa le mokhoa oa ho etsa semiconductor, khase ea litšila e hlahisoang ke mokhoa oa ho paka oa semiconductor e batla e le bonolo, haholo-holo khase e nang le acidic, epoxy resin le lerōle.
Khase ea litšila tse nang le asiti e hlahisoa haholo ka mekhoa e kang electroplating;
Khase ea litšila ea ho baka e hlahisoa nakong ea ho baka ka mor'a hore sehlahisoa se behe le ho tiisa;
Mochini oa ho qoelisa o hlahisa khase e litšila e nang le lerōle la silicon nakong ea ts'ebetso ea ho itšeha.

Mathata a tshilafalo ya tikoloho
Bakeng sa mathata a tšilafalo ea tikoloho indastering ea semiconductor, mathata a mantlha a hlokang ho rarolloa ke:
· Phallo e kholo ea lintho tse silafatsang moea le metsoako ea lintho tse phelang (VOCs) e feto-fetohang mosebetsing oa photolithography;
· Ho ntšoa ha metsoako ea perfluorinated (PFCS) ho plasma etching le mekhoa ea ho beha mouoane oa lik'hemik'hale;
• Tšebeliso e kholo ea matla le metsi tlhahisong le tšireletsong ea polokeho ea basebetsi;
· Tšebeliso le ho lekola ts'ilafalo ea lihlahisoa tse ling;
· Mathata a ho sebelisa lik'hemik'hale tse kotsi mekhoeng ea ho paka.

Tlhahiso e hloekileng
Theknoloji ea tlhahiso e hloekileng ea lisebelisoa tsa semiconductor e ka ntlafatsoa ho tloha likarolong tsa lisebelisoa tse tala, mekhoa le taolo ea ts'ebetso.

Ho ntlafatsa thepa le matla
Ntlha ea pele, ho hloeka ha thepa ho lokela ho laoloa ka thata ho fokotsa ho kenngoa ha litšila le likaroloana.
Taba ea bobeli, mocheso o fapaneng, ho lemoha ho lutla, ho thothomela, ho tsukutloa ha motlakase o phahameng haholo le liteko tse ling li lokela ho etsoa ho likarolo tse kenang kapa lihlahisoa tse felileng pele li hlahisoa.
Ho phaella moo, bohloeki ba lisebelisoa tse thusang bo lokela ho laoloa ka thata. Ho na le mekhoa e mengata ea theknoloji e ka sebelisoang bakeng sa tlhahiso e hloekileng ea matla.

Ntlafatsa ts'ebetso ea tlhahiso
Indasteri ea semiconductor ka boeona e ikitlaelletsa ho fokotsa tšusumetso ea eona tikolohong ka ntlafatso ea theknoloji ea ts'ebetso.
Ka mohlala, lilemong tsa bo-1970, li-solvents tsa organic li ne li sebelisoa haholo-holo ho hloekisa li-wafers ka theknoloji e kopanetsoeng ea ho hloekisa potoloho. Lilemong tsa bo-1980, litharollo tsa asiti le alkali tse kang sulfuric acid li ne li sebelisoa ho hloekisa liphaphatha. Ho fihlela lilemong tsa bo-1990, theknoloji ea ho hloekisa oksijene ea plasma e ile ea ntlafatsoa.
Mabapi le ho paka, lik'hamphani tse ngata hajoale li sebelisa theknoloji ea electroplating, e tla baka tšilafalo ea tšepe e boima tikolohong.
Leha ho le joalo, limela tsa ho paka Shanghai ha li sa sebelisa theknoloji ea electroplating, kahoo ha ho na tšusumetso ea litšepe tse boima tikolohong. Ho ka fumanoa hore indasteri ea semiconductor butle-butle e fokotsa phello ea eona tikolohong ka ntlafatso ea ts'ebetso le ho kenya lik'hemik'hale sebakeng sa eona sa nts'etsopele, e leng hape e latelang mokhoa oa hona joale oa tsoelo-pele ea lefats'e oa bobuelli le moralo oa lihlahisoa o thehiloeng tikolohong.

Hajoale, ntlafatso ea ts'ebetso ea lehae e ntse e etsoa, ​​ho kenyelletsa:
· Ho nkela sebaka le ho fokotsa khase ea all-ammonium PFCS, joalo ka ho sebelisa khase ea PFCs e nang le phello e tlase ea sethopo ho nkela khase sebaka ka phello e phahameng ea sethopo, joalo ka ho ntlafatsa phallo ea ts'ebetso le ho fokotsa palo ea khase ea PFCS e sebelisoang ts'ebetsong;
·Ho ntlafatsa tlhoekiso ea li-wafer tse ngata ho ea ho li-wafer tse le 'ngoe ho fokotsa palo ea lisebelisoa tsa ho hloekisa lik'hemik'hale tse sebelisoang mosebetsing oa ho hloekisa.
·Taolo e tiileng ea tšebetso:
a. Lemoha othomathike ea ts'ebetso ea tlhahiso, e ka hlokomelang ts'ebetso e nepahetseng le tlhahiso ea li-batch, le ho fokotsa sekhahla se phahameng sa liphoso tsa ts'ebetso ea matsoho;
b. Mekhoa ea tikoloho e hloekileng haholo, e ka bang 5% kapa ka tlase ho tahlehelo ea lihlahisoa e bakoa ke batho le tikoloho. Lintho tsa tikoloho tse hloekileng haholo li kenyelletsa bohloeki ba moea, metsi a hloekileng haholo, moea o hatelitsoeng, CO2, N2, mocheso, mongobo, joalo-joalo Boemo ba bohloeki ba workshop bo hloekileng hangata bo lekanyetsoa ka palo e kholo ea likaroloana tse lumelloang ka unit unit volume. moea, ke hore, palo ea palo ea likaroloana;
c. Matlafatsa mokhoa oa ho lemoha, 'me u khethe lintlha tsa bohlokoa tse lokelang ho fumanoa libakeng tsa mosebetsi tse nang le litšila tse ngata nakong ea tlhahiso.

 

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Nako ea poso: Aug-13-2024
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