Wararka

  • Waa maxay sababta darbiyada dhinacyadu u leexdaan marka ay engegan yihiin?

    Waa maxay sababta darbiyada dhinacyadu u leexdaan marka ay engegan yihiin?

    Labbis la'aanta bombada ion-ka Qalalan badanaa waa nidaam isku daraya saamaynta jirka iyo kiimikaad, kaas oo bamamka ion uu yahay habka muhiimka ah ee xoqidda jirka. Inta lagu jiro habka etching, xagasha dhacdada iyo qaybinta tamarta ee ions waxaa laga yaabaa inay sinaadaan. Haddii ion ay dhacdo ...
    Sii akhri
  • Hordhac saddex tignoolajiyada CVD ee caadiga ah

    Hordhac saddex tignoolajiyada CVD ee caadiga ah

    Kaydinta uumiga kiimikada (CVD) waa tignoolajiyada ugu ballaaran ee loo isticmaalo warshadaha semiconductor ee lagu xareeyo agabyo kala duwan, oo ay ku jiraan noocyo badan oo ah alaabada dahaarka, inta badan alaabada birta iyo alaabada daawaha birta ah. CVD waa tignoolajiyada diyaarinta filimada khafiifka ah ee dhaqameed. Maamulkeeda...
    Sii akhri
  • Dheeman ma beddeli karaa aaladaha kale ee tamarta sare leh?

    Dheeman ma beddeli karaa aaladaha kale ee tamarta sare leh?

    Sida aasaaska aaladaha elektiroonigga ah ee casriga ah, qalabka semiconductor-ka ayaa ku socda isbeddello aan horay loo arag. Maanta, dheemanku wuxuu si tartiib tartiib ah u muujinayaa awooddiisa weyn sida jiilka afraad ee semiconductor oo leh sifooyin koronto iyo kuleyl oo aad u wanaagsan iyo xasilloonida hoos aad u daran ...
    Sii akhri
  • Waa maxay habka qorshaynta ee CMP?

    Waa maxay habka qorshaynta ee CMP?

    Dual-Damascene waa tignoolajiyada geeddi-socod ee loo isticmaalo in lagu soo saaro isku xidhka birta ee wareegyada isku dhafan. Waa horumar dheeraad ah oo ku saabsan geeddi-socodka Dimishiq. Iyada oo la samaynayo iyada oo loo marayo godadka iyo jeexjeexyada isku mar ee habka isku midka ah oo lagu buuxiyo birta, wax soo saarka isku dhafan ee m ...
    Sii akhri
  • Graphite leh daahan TaC

    Graphite leh daahan TaC

    I. Habka sahaminta cabbirka 1. Nidaamka TaCl5-C3H6-H2-Ar 2. Heerkulka kaydinta: Marka loo eego qaaciddada thermodynamic, waxaa la xisaabiyaa marka heerkulku ka weyn yahay 1273K, Gibbs tamarta xorta ah ee falcelinta ayaa aad u hooseeya iyo falcelintu waa dhammaatay. Rea...
    Sii akhri
  • Habka kobaca kristal ee Silicon carbide iyo tignoolajiyada qalabka

    Habka kobaca kristal ee Silicon carbide iyo tignoolajiyada qalabka

    1. SiC crystal koritaanka technology wadada PVT (hab sublimation), HTCVD (CVD heerkulka sare), LPE (hab wajiga dareere) waa saddex hababka koritaanka SiC crystal caadiga ah; Habka ugu caansan ee warshadaha waa habka PVT, iyo in ka badan 95% ee kiristaalo SiC waxaa koray PVT ah ...
    Sii akhri
  • Diyaarinta iyo Hagaajinta Waxqabadka ee Walxaha Isku-dhafka ah ee Kaarboon Silikon

    Diyaarinta iyo Hagaajinta Waxqabadka ee Walxaha Isku-dhafka ah ee Kaarboon Silikon

    Baytariyada lithium-ion waxay inta badan u koraan jihada cufnaanta tamarta sare. Heerkulka qolka, agabka korantada taban ee silicon-ku-salaysan ee leh lithium si loo soo saaro badeecada hodanka ku ah Lithium ee wajiga Li3.75Si, oo leh awood gaar ah ilaa 3572 mAh / g, taas oo aad uga sareysa aragtida ...
    Sii akhri
  • Oxidation Thermal ee Silikoon Crystal ah oo Keliya

    Oxidation Thermal ee Silikoon Crystal ah oo Keliya

    Samaynta Silicon dioxide ee dusha sare ee silikon waxa loo yaqaan oksaydh (oxidation), iyo abuurista silikoon ogsaydhdhismeed deggan oo xooggan ayaa keentay dhalashada tignoolajiyada qorshaynta wareegga isku dhafan ee silikoon. Inkasta oo ay jiraan siyaabo badan oo si toos ah ugu koraya silikoon dioxide dusha silico...
    Sii akhri
  • Habaynta UV ee Baakadaha Heerka Wafer-ka-baxsan

    Habaynta UV ee Baakadaha Heerka Wafer-ka-baxsan

    Baakadaha heerka wafer-ka (FOWLP) waa hab wax ku ool ah oo wax ku ool ah warshadaha semiconductor. Laakiin waxyeellooyinka caadiga ah ee habkani waa warping iyo chip offset. In kasta oo horumarka joogtada ah ee heerka wafer-ka iyo tignoolajiyada heerka guddi taageere ka baxayso, arrimahan la xidhiidha qaabaynta ayaa weli ah ...
    Sii akhri
WhatsApp Online chat!