SiC Wafer Boat / Shongwe

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ProductDescription

Silicon carbide Wafer Boat inoshandiswa zvakanyanya sechifukidzo chibatiso mune yakanyanya tembiricha yekuparadzira maitiro.

Zvakanakira:

High tembiricha kuramba:kushandiswa kwakajairika pa1800 ℃

High thermal conductivity:yakaenzana neye graphite zvinhu

High kuoma:kuoma kwechipiri chete kune diamond, boron nitride

Corrosion resistance:asidhi yakasimba uye alkali haina ngura kwairi, iyo corrosion resistance iri nani pane tungsten carbide uye alumina.

Chiremba uremu:low density, pedyo nealuminium

Hapana deformation: yakaderera coefficient yekuwedzera kwekupisa

Thermal shock resistance:inogona kumira kushanduka kwekushisa kwakapinza, kuramba kuvhunduka kwekushisa, uye ine kushanda kwakagadzikana

 

Zvenyama Zvimiro zveSiC

Property Value Nzira
Density 3.21 g/cc Sink-float uye dimension
Kupisa chaiko 0.66 J/g °K Pulsed laser flash
Flexural simba 450 MPa560 MPa 4 point bend, RT4 point bend, 1300°
Kutsemuka kuomarara 2.94 MPa m1/2 Microindentation
Kuoma 2800 Vicker's, 500g mutoro
Elastic ModulusYoung's Modulus 450 GPA430 GPA 4 pt bend, RT4 pt bend, 1300 °C
Saizi yezviyo 2 – 10 µm SEM

 

Thermal Properties yeSiC

Thermal Conductivity 250 W/m °K Laser flash nzira, RT
Kuwedzera kweThermal (CTE) 4.5 x 10-6 °K Tembiricha yemumba kusvika 950 °C, silica dilatometer

 

 

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