fan out wafer degree packaging (FOWLP) na ụlọ ọrụ semiconductor maara maka ịdị ọnụ ahịa, mana ọ bụghị na-enweghị ihe ịma aka ya. Otu n'ime isi okwu a na-eche ihu bụ mgbagha na mmalite nke n'oge usoro ịkpụzi. Warp nwere ike bụrụ ihe a na-ahụta na mbelata kemịkalụ nke ngwakọta ịkpụzi yana enweghị nha nha nke mgbasawanye thermal, ebe ọ na-amalite n'ihi ọdịnaya dị elu na ihe na-akpụzi siropy. Otú ọ dị, site n'enyemaka nkeAI enweghị ike ịchọpụta, ngwọta bụ nyocha iji mee ka ihe ịma aka ndị a dịkwuo mma.
DELO, ụlọ ọrụ na-edu ndú na ụlọ ọrụ ahụ, na-eduzi nyocha nke ike iji dozie okwu ndị a site na ijikọta ntakịrị na ihe na-ebu ihe na-eme ihe na-enweghị viscosity dị ala na ultraviolet hardening. N'iji ya tụnyere warpage nke ihe dị iche iche, a chọpụtara na ultraviolet hardening na-ebelata agha n'oge oge jụrụ oyi mgbe akpụzichara ya. Ojiji nke ultraviolet hardening ihe abụghị naanị ibelata mkpa ndochi kamakwa belata viscosity na modul nke Young, n'ikpeazụ mbelata ntakịrị mmalite. Nkwalite a na teknụzụ na-egosi ikike imepụta onye ndu onye na-ebupụta ngwugwu ogo wafer na obere warpage na mmalite ntakịrị.
N'ozuzu, nyocha ahụ gosipụtara uru nke iji ultraviolet hardening na usoro ịkpụzi nnukwu mpaghara, na-enye azịza maka ihe ịma aka na-eche ihu na nkwakọ ngwaahịa fan-out wafer-degree. Site n'ikike ibelata warpage na ịnwụ ngbanwe, ebe ị na-edezi ihe nkiri na oge ike na ike ike, prọfesọ ultraviolet siri ike ka ọ bụrụ usoro nkwa na ụlọ ọrụ semiconductor. N'agbanyeghị ọdịiche dị na ọnụọgụ mgbasawanye thermal n'etiti ihe, iji ultraviolet hardening na-enye nhọrọ dị mma maka ịdị mma na ịdịmma nke nkwakọ ngwaahịa wafer.
Oge nzipu: Ọktoba 28-2024