fan out wafer degree packaging (FOWLP) na ụlọ ọrụ semiconductor maara maka ịdị ọnụ ahịa, mana ọ bụghị na-enweghị ihe ịma aka ya. Otu n'ime isi okwu a na-eche ihu bụ mgbagha na mmalite nke n'oge usoro ịkpụzi. Warp nwere ike bụrụ ihe a na-ahụta na mbelata kemịkalụ nke ngwakọta ịkpụzi yana enweghị nha nha nke mgbasawanye thermal, ebe ọ na-amalite n'ihi ọdịnaya dị elu na ihe na-akpụzi siropy. Otú ọ dị, site n'enyemaka nkeAI enweghị ike ịchọpụta, ngwọta bụ nyocha iji mee ka ihe ịma aka ndị a dịkwuo mma.
DELO, ụlọ ọrụ na-edu ndú na ụlọ ọrụ ahụ, na-eduzi nyocha nke ike iji dozie okwu ndị a site na ijikọta ntakịrị na ihe na-ebu ihe na-eme ihe na-enweghị viscosity dị ala na ultraviolet hardening. N'iji ya tụnyere warpage nke ihe dị iche iche, a chọpụtara na ultraviolet hardening na-ebelata agha n'oge oge jụrụ oyi mgbe ịkpụzi ya. Ojiji nke ultraviolet hardening ihe ọ bụghị naanị ibelata mkpa ndochi kamakwa belata viscosity na modul nke Young, n'ikpeazụ mbelata ntakịrị mmalite. Nkwalite a na teknụzụ na-egosi ikike imepụta onye ndu onye na-ebupụta ngwugwu ogo wafer na obere warpage na mmalite ntakịrị.
N'ozuzu, nyocha ahụ gosipụtara uru nke iji ultraviolet hardening na usoro ịkpụzi nnukwu mpaghara, na-enye azịza maka ihe ịma aka na-eche ihu na nkwakọ ngwaahịa fan-out wafer-degree. Site n'ikike ibelata warpage na ịnwụ ngbanwe, ebe ị na-edezi ihe nkiri na oge ike na ike ike, prọfesọ ultraviolet siri ike ka ọ bụrụ usoro nkwa na ụlọ ọrụ semiconductor. N'agbanyeghị ọdịiche dị na ọnụọgụ mgbasawanye thermal n'etiti ihe, iji ultraviolet hardening na-enye nhọrọ dị mma maka ịdị mma na ịdịmma nke nkwakọ ngwaahịa wafer.
Oge nzipu: Ọktoba 28-2024