Ntxuam tawm wafer qib ntim (FOWLP) yog ib txoj kev siv nyiaj zoo hauv kev lag luam semiconductor. Tab sis cov kev mob tshwm sim ntawm cov txheej txheem no yog warping thiab chip offset. Txawm hais tias kev txhim kho txuas ntxiv ntawm qib wafer thiab vaj huam sib luag qib kiv cua tawm tshuab, cov teeb meem cuam tshuam nrog molding tseem muaj nyob.
Warping yog tshwm sim los ntawm cov tshuaj shrinkage ntawm kua compression molding compound (LCM) thaum kho thiab txias tom qab molding. Qhov thib ob yog vim li cas rau warping yog qhov tsis sib xws hauv coefficient ntawm thermal expansion (CTE) ntawm silicon nti, molding khoom, thiab substrate. Offset yog vim lub fact tias viscous molding cov ntaub ntawv uas muaj cov ntsiab lus muab tub lim feem ntau tsuas yog siv nyob rau hauv qhov kub thiab txias. Raws li cov nti tau tsau rau cov neeg nqa khoom los ntawm kev sib txuas ib ntus, qhov kub nce ntxiv yuav ua rau cov nplaum nplaum, yog li ua rau nws lub zog nplaum tsis muaj zog thiab txo nws lub peev xwm los kho cov nti. Qhov thib ob yog vim li cas rau qhov offset yog tias lub siab xav tau rau molding tsim kev ntxhov siab ntawm txhua nti.
Txhawm rau nrhiav kev daws teeb meem rau cov teeb meem no, DELO tau ua txoj kev tshawb fawb muaj peev xwm los ntawm kev sib txuas ib qho yooj yim analog nti mus rau tus neeg nqa khoom. Nyob rau hauv cov nqe lus ntawm kev teeb tsa, cov cab kuj wafer yog coated nrog ib ntus daim nplaum nplaum, thiab cov nti tau muab tso rau pem hauv ntej. Tom qab ntawd, lub wafer tau molded siv cov viscosity tsawg DELO nplaum thiab kho nrog ultraviolet hluav taws xob ua ntej tshem tawm cov cab kuj wafer. Nyob rau hauv xws li daim ntawv thov, siab viscosity thermosetting molding composites feem ntau yog siv.
DELO kuj tau piv cov warpage ntawm thermosetting molding cov ntaub ntawv thiab UV kho cov khoom hauv qhov kev sim, thiab cov txiaj ntsig tau pom tias cov khoom siv molding yuav warp thaum lub sij hawm txias tom qab thermosetting. Yog li ntawd, siv chav sov ultraviolet curing es tsis txhob cua sov curing tuaj yeem txo qhov cuam tshuam ntawm thermal expansion coefficient mismatch ntawm molding compound thiab cov cab kuj, yog li txo qis warping mus rau qhov loj tshaj plaws.
Kev siv cov khoom siv ultraviolet curing tuaj yeem txo qhov kev siv cov fillers, yog li txo cov viscosity thiab Young's modulus. Lub viscosity ntawm cov qauv nplaum siv hauv qhov kev xeem yog 35000 mPa · s, thiab cov Young's modulus yog 1 GPa. Vim tias tsis muaj cua sov lossis siab siab ntawm cov khoom siv molding, chip offset tuaj yeem txo kom tsawg rau qhov loj tshaj plaws. Ib tug raug molding compound muaj ib tug viscosity ntawm txog 800000 mPa · s thiab ib tug Young's modulus nyob rau hauv ntau ntawm ob tug lej.
Zuag qhia tag nrho, kev tshawb fawb tau pom tias siv UV kho cov ntaub ntawv rau thaj tsam loj molding yog qhov zoo rau kev tsim cov chip thawj kiv cua tawm wafer qib ntim, thaum txo qis warpage thiab chip offset mus rau qhov loj tshaj plaws. Txawm hais tias qhov sib txawv tseem ceeb hauv thermal expansion coefficients ntawm cov ntaub ntawv siv, cov txheej txheem no tseem muaj ntau yam kev siv vim qhov tsis muaj qhov sib txawv ntawm qhov kub thiab txias. Tsis tas li ntawd, UV curing tuaj yeem txo cov sijhawm kho thiab siv zog.
UV es tsis txhob thermal curing txo warpage thiab tuag hloov hauv kiv cua-tawm wafer-theem ntim
Kev sib piv ntawm 12-nti coated wafers siv lub thermally kho, high-filler compound (A) thiab UV-kho compound (B)
Post lub sij hawm: Nov-05-2024