nkag siab txog semiconductor wafer contamination thiab tu txheej txheem

Thaum nws phev musxov xwm lag luam, nkag siab txog qhov elaborateness ntawm semiconductor fabrication yog yuav tsum tau. semiconductor wafer yog qhov tseem ceeb hauv kev lag luam no, tab sis lawv feem ntau ntsib kev sib kis los ntawm ntau yam impurity. Cov kab mob no, suav nrog atom, organic teeb meem, hlau hlau ion, thiab oxide, tuaj yeem cuam tshuam cov txheej txheem fabrication.

Cov khoomxws li polymer thiab etching impurity ntseeg ntawm intermolecular quab yuam rau adsorb ntawm lub wafer nto, cuam tshuam cov cuab yeej photolithography.organic impuritieszoo li homo daim tawv nqaij roj thiab tshuab roj daim duab yeeb yaj kiab ntawm wafer, impede tu.hlau ionszoo li hlau thiab txhuas feem ntau tshem tawm los ntawm kev tsim cov hlau hlau ion complex.Oxidesimpede fabrication txheej txheem thiab feem ntau yog tshem tawm los ntawm tsau nyob rau hauv dilute hydrofluoric acid.

chemical txoj kevfeem ntau yog siv los ntxuav thiab jerk semiconductor wafer. Cov txheej txheem tshuaj ntxuav dej noo xws li kev daws teeb meem submergence thiab mechanical scrub yog prevailing. supersonic thiab megasonic tu txoj kev muaj peev xwm tshem tawm impurity. Cov tshuaj ntxuav qhuav qhuav, suav nrog plasma thiab roj theem thev naus laus zis, kuj tseem ua haujlwm hauv cov txheej txheem ntxuav semiconductor wafer.


Post lub sij hawm: Oct-29-2024
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