Chemical Vapor Deposition (CVD) yog ib qho tseem ceeb nyias zaj duab xis deposition technology, feem ntau siv los npaj ntau yam ua hauj lwm films thiab nyias-txheej ntaub ntawv, thiab yog dav siv nyob rau hauv semiconductor manufacturing thiab lwm yam teb.
1. Lub hauv paus ntsiab lus ua haujlwm ntawm CVD
Nyob rau hauv cov txheej txheem CVD, cov roj precursor (ib los yog ntau dua gaseous precursor compounds) yog coj mus rau hauv kev sib cuag nrog lub substrate nto thiab rhuab mus rau ib tug tej yam kub thiab txias los ua ib tug tshuaj tiv thaiv thiab tso rau ntawm lub substrate nto los tsim cov yam xav tau zaj duab xis los yog txheej. txheej. Cov khoom ntawm cov tshuaj tiv thaiv no yog ib qho khoom, feem ntau yog ib qho kev sib xyaw ntawm cov khoom xav tau. Yog tias peb xav lo silicon rau saum npoo, peb tuaj yeem siv trichlorosilane (SiHCl3) ua cov roj ua ntej: SiHCl3 → Si + Cl2 + HCl Silicon yuav khi rau txhua qhov chaw raug (ob sab hauv thiab sab nraud), thaum chlorine thiab hydrochloric acid gases yuav raug tshem tawm ntawm lub chamber.
2. CVD kev faib tawm
Thermal CVD: Los ntawm cua sov cov roj precursor kom decompose thiab tso rau ntawm lub substrate nto. Plasma Enhanced CVD (PECVD): Plasma yog ntxiv rau thermal CVD los txhim kho cov tshuaj tiv thaiv tus nqi thiab tswj cov txheej txheem deposition. Hlau Organic CVD (MOCVD): Siv cov hlau organic sib txuas ua cov roj av ua ntej, cov yeeb yaj kiab nyias ntawm cov hlau thiab cov khoom siv hluav taws xob tuaj yeem npaj tau, thiab feem ntau siv los tsim cov khoom siv xws li LEDs.
3. Daim ntawv thov
(1) Semiconductor kev tsim khoom
Silicide zaj duab xis: siv los npaj cov txheej insulating, substrates, cais txheej, thiab lwm yam. Nitride zaj duab xis: siv los npaj silicon nitride, aluminium nitride, thiab lwm yam., siv hauv LEDs, cov khoom siv fais fab, thiab lwm yam. Hlau zaj duab xis: siv los npaj cov txheej txheem conductive, metallized txheej, thiab lwm yam.
(2) Zaub technology
ITO zaj duab xis: Transparent conductive oxide zaj duab xis, feem ntau siv nyob rau hauv vaj huam sib luag vaj huam sib luag thiab kov cov ntxaij vab tshaus. Copper zaj duab xis: siv los npaj cov khaubncaws sab nraud povtseg, cov kab hluav taws xob, thiab lwm yam, txhawm rau txhim kho kev ua haujlwm ntawm cov khoom siv.
(3) Lwm qhov chaw
Cov txheej txheem kho qhov muag: suav nrog cov tshuaj tiv thaiv kev cuam tshuam, cov ntxaij lim dej kho qhov muag, thiab lwm yam. Anti-corrosion txheej: siv rau hauv cov khoom siv tsheb, cov khoom siv hauv aerospace, thiab lwm yam.
4. Cov yam ntxwv ntawm CVD txheej txheem
Siv ib puag ncig kub los txhawb cov tshuaj tiv thaiv ceev. Feem ntau ua nyob rau hauv ib qho chaw nqus tsev vacuum. Cov kab mob ntawm qhov chaw ntawm qhov chaw yuav tsum tau muab tshem tawm ua ntej pleev xim. Cov txheej txheem yuav muaj kev txwv ntawm cov substrates uas tuaj yeem coated, piv txwv li kev txwv qhov kub thiab txias lossis kev txwv tsis pub muaj kev cuam tshuam. CVD txheej yuav npog tag nrho cov cheeb tsam ntawm ib feem, nrog rau cov xov, qhov qhov muag tsis pom thiab sab hauv. Tej zaum yuav txwv tsis pub muaj peev xwm npog qhov chaw tshwj xeeb. Zaj duab xis thickness yog txwv los ntawm cov txheej txheem thiab cov khoom siv. Superior adhesion.
5. Qhov zoo ntawm CVD tshuab
Uniformity: Muaj peev xwm ua tau zoo ib yam tso rau ntawm thaj chaw loj substrates.
Controllability: Tus nqi deposition thiab zaj duab xis zog tuaj yeem hloov kho los ntawm kev tswj tus nqi ntws thiab qhov kub thiab txias ntawm cov roj ua ntej.
Versatility: Haum rau kev tso tawm ntau yam khoom, xws li hlau, semiconductors, oxides, thiab lwm yam.
Post lub sij hawm: May-06-2024