High Purity 8 nti Silicon Wafer

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VET Energy's high-purity 8-nti silicon wafers yog koj qhov kev xaiv zoo tshaj plaws rau kev tsim khoom semiconductor. Ua los ntawm kev siv thev naus laus zis, cov wafers muaj cov khoom siv lead ua zoo heev thiab qhov chaw tiaj tus, ua rau lawv tsim nyog rau kev tsim khoom ntawm ntau yam khoom siv microelectronic.


Product Detail

Khoom cim npe

VET Energy's 8-nti silicon wafers yog siv dav hauv cov khoom siv hluav taws xob, cov khoom siv hluav taws xob, cov khoom siv sib txuas thiab lwm yam. Ua ib tus thawj coj hauv kev lag luam semiconductor, peb tau cog lus los muab cov khoom zoo Si Wafer kom tau raws li qhov xav tau ntawm peb cov neeg siv khoom.

Ntxiv rau Si Wafer, VET Energy kuj muab ntau yam khoom siv semiconductor substrate, suav nrog SiC Substrate, SOI Wafer, SiN Substrate, Epi Wafer, thiab lwm yam. Wafer, muab kev txhawb zog rau kev tsim cov khoom siv hluav taws xob txuas ntxiv mus.

VET Energy muaj cov cuab yeej tsim khoom siab heev thiab ua tiav kev tswj hwm zoo kom ntseeg tau tias txhua lub wafer ua tau raws li cov qauv kev lag luam nruj. Peb cov khoom tsis yog tsuas yog muaj cov khoom siv hluav taws xob zoo, tab sis kuj muaj lub zog zoo txhua yam thiab thermal stability.

VET Energy muab cov neeg siv khoom nrog cov kev daws teeb meem wafer, suav nrog wafers ntawm ntau qhov sib txawv, hom thiab doping concentrations. Tsis tas li ntawd, peb kuj muab kev pabcuam kev tshaj lij thiab kev pabcuam tomqab muag los pab cov neeg siv khoom daws teebmeem ntau yam uas tau ntsib thaum lub sijhawm tsim khoom.

Xov xwm 6-36
Xov xwm 6/35

WAFFERING SPECIFICATIONS

*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Qib,Sl=Semi-lnsulating

Yam khoom

8-Inch

6-Inch

4-Inch

np

n- Pm

n-Ps

SI

SI

TVV (GBIR)

≤ 6 hli

≤ 6 hli

Hneev (GF3YFCD) - Tus Nqi Tsis Muaj

≤15μm

≤15μm

≤ 25μm

≤15μm

Warp (GF3YFER)

≤ 25μm

≤ 25μm

≤ 40μm

≤ 25μm

LTV (SBIR)-10mmx10mm

<2 m

Wafer Ntug

Beveling

NTAU NTAU

*n-Pm=n-type Pm-Grade,n-Ps=n-type Ps-Qib,Sl=Semi-lnsulating

Yam khoom

8-Inch

6-Inch

4-Inch

np

n- Pm

n-Ps

SI

SI

Nto tiav

Ob chav sab Optical Polish, Si- ntsej muag CMP

SurfaceRoughness

(10um x 10um) Si-FaceRa≤0.2nm
C-Face Ra≤ 0.5nm

(5umx5um) Si-Face Ra≤0.2nm
C-Face Ra≤0.5nm

Ntug Chips

Tsis Muaj Kev Tso Cai (ntev thiab dav ≥0.5mm)

Indents

Tsis Muaj Tso Cai

Scratches (Si-Face)

Qty.≤ 5, Ua kom tiav
Length≤0.5 × wafer txoj kab uas hla

Qty.≤ 5, Ua kom tiav
Length≤0.5 × wafer txoj kab uas hla

Qty.≤ 5, Ua kom tiav
Length≤0.5 × wafer txoj kab uas hla

Kev tawg

Tsis Muaj Tso Cai

Ntug Exclusion

3mm ib

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