ʻO ka hana ʻana o nā hāmeʻa Semiconductor ka mea nui i nā polokalamu discrete, nā kaʻina hoʻohui a me kā lākou kaʻina hana.
Hiki ke hoʻokaʻawale ʻia ka hana semiconductor i ʻekolu mau ʻanuʻu: hana kino huahana huahana, huahanawaferhana ʻana a me ka hui ʻana o nā mea hana. I waena o lākou, ʻo ka pollution koʻikoʻi loa ka pae hana wafer huahana.
Hoʻokaʻawale nui ʻia nā mea hoʻohaumia i ka wai ʻino, ka ʻōpala a me ka ʻōpala paʻa.
Kaʻina hana chip:
Wafer silikonima hope o ka wili ʻana i waho - hoʻomaʻemaʻe - oxidation - kūʻē kūʻokoʻa - photolithography - hoʻomohala - etching - diffusion, implantation ion - chemical vapor deposition - chemical mechanical polishing - metallization, etc.
Wai ʻōpala
Hoʻokumu ʻia ka nui o ka wai ʻino i kēlā me kēia kaʻina hana o ka hana semiconductor a me ka hoʻāʻo ʻana i ka hoʻomaʻamaʻa ʻana, ʻo ka nui o ka wai ʻawaʻawa kumu, ka wai ʻōpala i loko o ka ammonia a me ka wai ʻōpala.
1. Ka wai ʻino i loko o ka Fluorine:
Lilo ka waika Hydrofluoric i mea hoʻoheheʻe nui i hoʻohana ʻia i nā kaʻina oxidation a me ka etching ma muli o kāna mau mea oxidizing a corrosive. Loaʻa ka wai ʻino i loko o ka fluorine i ke kaʻina hana mai ke kaʻina diffusion a me ke kaʻina hana polishing chemical i loko o ke kaʻina hana chip. I ka hoʻomaʻemaʻe ʻana i nā wafers silicon a me nā mea pili, hoʻohana ʻia ka waika hydrochloric i nā manawa he nui. Hoʻopau ʻia kēia mau kaʻina hana a pau i loko o nā pahu etching i hoʻolaʻa ʻia a i ʻole nā mea hoʻomaʻemaʻe, no laila hiki ke hoʻokuʻu kūʻokoʻa ka wai me ka fluorine. E like me ka hoʻopaʻa ʻana, hiki ke hoʻokaʻawale ʻia i loko o ka wai ʻawaʻawa fluorine-koʻikoʻi a me ka wai hoʻohaʻahaʻa haʻahaʻa i loko o ka amonia. ʻO ka maʻamau, hiki ke piʻi i ka 100-1200 mg / L ka ʻike nui o ka wai ʻawaʻawa i loko o ka ammonia kiʻekiʻe. Hoʻohana hou ka hapa nui o nā ʻoihana i kēia ʻāpana o ka wai ʻino no nā kaʻina hana ʻaʻole koi i ka wai kiʻekiʻe.
2. ʻO ka wai ʻawaʻawa kumu:
Kokoke i kēlā me kēia kaʻina hana i loko o ke kaʻina hana kaʻapuni i hoʻohui ʻia e pono e hoʻomaʻemaʻe ʻia ka chip. I kēia manawa, ʻo ka sulfuric acid a me ka hydrogen peroxide ka wai hoʻomaʻemaʻe maʻamau i hoʻohana ʻia i loko o ke kaʻina hana hana kaapuni. I ka manawa like, hoʻohana pū ʻia nā reagents acid-base e like me nitric acid, hydrochloric acid a me ka wai amonia.
ʻO ka wai ʻawaʻawa kumu o ke kaʻina hana mai ka hoʻomaʻemaʻe ʻana i ke kaʻina hana chip. I ke kaʻina hana hoʻopili, mālama ʻia ka chip me ka hopena acid-base i ka wā electroplating a me ka nānā ʻana kemika. Ma hope o ka hoʻomaʻamaʻa ʻana, pono e holoi ʻia me ka wai maʻemaʻe e hoʻohua ai i ka wai holoi wai waika. Eia kekahi, hoʻohana pū ʻia nā reagents acid-base e like me ka sodium hydroxide a me ka waika hydrochloric i loko o ke kahua wai maʻemaʻe e hana hou i nā anion a me nā resins cation e hana i ka wai hoʻōla hou i ka wai. Hoʻopuka pū ʻia ka wai huelo holoi i ka wā o ka holoi ʻana i ke kinoea kino kumu waika. I loko o nā ʻoihana hana kaapuni hoʻohui, ʻoi aku ka nui o ka wai ʻawaʻawa kumu.
3. ʻO ka wai ʻōpala organik:
Ma muli o nā kaʻina hana like ʻole, ʻokoʻa loa ka nui o nā solvents organik i hoʻohana ʻia i ka ʻoihana semiconductor. Eia nō naʻe, ma ke ʻano he mea hoʻomaʻemaʻe, hoʻohana nui ʻia nā solvents organik i nā loulou like ʻole o ka ʻeke hana. Lilo kekahi mau mea hoʻoheheʻe i ka wai ʻōpala organik.
4. ʻO nā wai ʻino ʻē aʻe:
ʻO ke kaʻina hana etching o ke kaʻina hana semiconductor e hoʻohana i ka nui o ka ammonia, fluorine a me ka wai maʻemaʻe kiʻekiʻe no ka decontamination, a laila e hoʻohua ai i ka hoʻokuʻu ʻana i ka wai ʻino.
Pono ke kaʻina hana electroplating i ke kaʻina hana semiconductor packaging. Pono e hoʻomaʻemaʻe ʻia ka chip ma hope o ka electroplating, a e hana ʻia ka wai hoʻomaʻemaʻe electroplating ma kēia kaʻina hana. No ka mea ua hoʻohana ʻia kekahi mau metala i ka electroplating, e loaʻa nā ion ion i loko o ka wai hoʻomaʻemaʻe electroplating, e like me ke alakaʻi, tin, disc, zinc, aluminika, etc.
ʻAi kinoea
No ka mea he kiʻekiʻe loa nā koi o ke kaʻina semiconductor no ka maʻemaʻe o ka lumi hana, hoʻohana mau ʻia nā mea pā e huki i nā ʻano kinoea ʻōpala i hoʻololi ʻia i ka wā o ke kaʻina hana. No laila, ʻike ʻia ka hoʻokuʻu ʻia ʻana o ke kinoea i loko o ka ʻoihana semiconductor e ka nui exhaust volume a me ka haʻahaʻa haʻahaʻa. Hoʻopili nui ʻia nā hoʻokuʻu kinoea ʻōpala.
Hiki ke hoʻokaʻawale ʻia kēia mau mea hoʻokuʻu kinoea i ʻehā mau ʻāpana: ke kinoea ʻakika, ke kinoea alkaline, ke kinoea ʻōpala organik a me ke kinoea ʻawaʻawa.
1. ʻO ke kinoea hoʻoheheʻe acid-base:
ʻO ke kinoea hoʻoheheʻe acid-base ka nui mai ka diffusion,CVD, CMP a me nā kaʻina hana etching, e hoʻohana ana i ka hoʻomaʻemaʻe hoʻomaʻemaʻe acid-base e hoʻomaʻemaʻe i ka wafer.
I kēia manawa, ʻo ka mea hoʻomaʻemaʻe hoʻomaʻemaʻe maʻamau i hoʻohana ʻia i ke kaʻina hana semiconductor ka hui ʻana o ka hydrogen peroxide a me ka sulfuric acid.
ʻO ke kinoea ʻōpala i hana ʻia i loko o kēia mau kaʻina e pili ana i nā kinoea acidic e like me ka sulfuric acid, hydrofluoric acid, hydrochloric acid, nitric acid a me ka phosphoric acid, a ʻo ke kinoea alkaline ka nui o ka ammonia.
2. Ke kinoea ʻōpala organik:
Loaʻa ka kinoea ʻōpala organik mai nā kaʻina hana e like me photolithography, hoʻomohala ʻana, etching a me ka laha ʻana. I loko o kēia mau kaʻina hana, hoʻohana ʻia ka hopena kūlohelohe (e like me ka isopropyl alcohol) e hoʻomaʻemaʻe i ka ʻili o ka wafer, a ʻo ke kinoea ʻōpala i hana ʻia e ka volatilization kekahi o nā kumu o ke kinoea ʻōpala organik;
I ka manawa like, ʻo ka photoresist (photoresist) i hoʻohana ʻia i ke kaʻina hana o ka photolithography a me ka etching aia nā mea hoʻoheheʻe organika volatile, e like me ka butyl acetate, e hoʻoheheʻe ʻia i ka lewa i ka wā o ke kaʻina hana wafer, ʻo ia kekahi kumu o ke kinoea ʻōpala.
3. ʻO ke kinoea ʻona ʻona:
ʻO ke kinoea ʻōpala ʻawaʻawa ka nui mai nā kaʻina hana e like me ka epitaxy crystal, dry etching a me CVD. Ma kēia mau kaʻina hana, hoʻohana ʻia nā ʻano kinoea kūikawā maʻemaʻe kiʻekiʻe e hana i ka wafer, e like me ke silicon (SiHj), phosphorus (PH3), carbon tetrachloride (CFJ), borane, boron trioxide, a me nā mea ʻē aʻe. ʻāhuehue a ʻino.
I ka manawa like, i ka etching maloʻo a me ka hoʻomaʻemaʻe kaʻina hana ma hope o kemika mahu deposition i semiconductor manufacturing, he nui nui o piha oxide (PFCS) kinoea i koi 'ia, e like me NFS, C2F&CR, C3FS, CHF3, SF6, etc. loaʻa i ka absorption ikaika i ka ʻāpana kukui infrared a noho i ka lewa no ka manawa lōʻihi. Manaʻo ʻia ʻo lākou ke kumu nui o ka hopena ʻōmaʻomaʻo honua.
4. Packaging kaʻina 'ōpala kinoea:
Hoʻohālikelike ʻia me ke kaʻina hana semiconductor, maʻalahi ke kinoea ʻōpala i hana ʻia e ke kaʻina hana semiconductor packaging, ʻoi aku ka nui o ke kinoea acidic, epoxy resin a me ka lepo.
Hoʻokumu nui ʻia ke kinoea ʻōpala acid i nā kaʻina hana e like me ka electroplating;
Hoʻokumu ʻia ke kinoea ʻōpala ʻōpala ma ke kaʻina hana ʻana ma hope o ka hoʻopili ʻana a me ka sila ʻana o ka huahana;
Hoʻopuka ka mīkini dicing i ke kinoea ʻōpala i loko o ka lepo silika i ka wā o ke kaʻina ʻoki wafer.
Nā pilikia hoʻohaumia kaiapuni
No nā pilikia pollution kaiapuni i ka ʻoihana semiconductor, ʻo nā pilikia nui e pono e hoʻoponopono ʻia:
· Ka hoʻokuʻu ʻia ʻana o nā mea haumia ea a me nā mea hoʻohuihui kūlohelohe (VOC) i ke kaʻina photolithography;
· Ka hoʻokuʻu ʻana o nā pūhui perfluorinated (PFCS) i loko o ka etching plasma a me nā kaʻina hoʻoheheʻe kemika;
· Nui ka hoʻohana ʻana i ka ikehu a me ka wai i ka hana a me ka palekana palekana o nā limahana;
· Ka hana hou ʻana a me ka nānā ʻana i ka pollution o nā huahana ma hope;
· Nā pilikia o ka hoʻohana ʻana i nā kemika pōʻino i nā kaʻina hana hoʻopili.
Hana maʻemaʻe
Hiki ke hoʻomaikaʻi ʻia ka ʻenehana hana maʻemaʻe Semiconductor mai nā ʻano o nā mea maka, nā kaʻina hana a me nā kaʻina hana.
Hoʻomaikaʻi i nā mea maka a me ka ikehu
ʻO ka mea mua, pono e hoʻomalu ponoʻia ka maʻemaʻe o nā mea e ho'ēmi i ka hoʻokomoʻana i nā mea haumia a me nā'āpana.
ʻO ka lua, pono e hoʻokō ʻia nā ʻano wela like ʻole, ka ʻike leak, vibration, high-voltage electric shock a me nā hoʻokolohua ʻē aʻe i nā mea e komo mai ai a i ʻole nā huahana semi-finished ma mua o ka hoʻokomo ʻana i ka hana.
Eia kekahi, pono e mālama pono ʻia ka maʻemaʻe o nā mea kōkua. Nui nā ʻenehana i hiki ke hoʻohana ʻia no ka hana maʻemaʻe o ka ikehu.
E hoʻonui i ka hana hana
Ke hoʻoikaika nei ka ʻoihana semiconductor e hōʻemi i kona hopena i ke kaiapuni ma o ka hoʻomaikaʻi ʻana i ka ʻenehana.
No ka laʻana, i ka makahiki 1970, ua hoʻohana nui ʻia nā solvents organik e hoʻomaʻemaʻe i nā wafers i ka ʻenehana hoʻomaʻemaʻe kaapuni hui. I ka makahiki 1980, ua hoʻohana ʻia nā ʻakika a me nā mea alkali e like me ka sulfuric acid e hoʻomaʻemaʻe i nā wafers. A hiki i ka 1990s, ua hoʻomohala ʻia ka ʻenehana hoʻomaʻemaʻe oxygen plasma.
Ma ke ʻano o ka hoʻopili ʻana, hoʻohana ka hapa nui o nā ʻoihana i ka ʻenehana electroplating, kahi e hoʻohaumia ai i ka metala kaumaha i ke kaiapuni.
Eia nō naʻe, ʻaʻole hoʻohana hou nā mea kanu palaki ma Shanghai i ka ʻenehana electroplating, no laila ʻaʻohe hopena o nā metala kaumaha ma ke kaiapuni. Hiki ke ʻike ʻia ke hoʻemi mālie nei ka ʻoihana semiconductor i kona hopena i ke kaiapuni ma o ka hoʻomaikaʻi ʻana i ke kaʻina hana a me ka hoʻololi kemika i kāna kaʻina hana ponoʻī, e hahai pū ana i ke ʻano hoʻomohala honua o kēia manawa o ke kaʻina aʻoaʻo a me ka hoʻolālā huahana e pili ana i ke kaiapuni.
I kēia manawa, ʻoi aku ka nui o nā hoʻomaikaʻi kaʻina hana kūloko e hana ʻia nei, me:
· Ka hoʻololi a me ka hoʻohaʻahaʻa ʻana i nā kinoea PFCS āpau-ammonium, e like me ka hoʻohana ʻana i nā kinoea PFCs me ka hopena ʻōmaʻomaʻo haʻahaʻa e hoʻololi i ke kinoea me ka hopena ʻōmaʻomaʻo kiʻekiʻe, e like me ka hoʻomaikaʻi ʻana i ke kahe kaʻina a me ka hoʻemi ʻana i ka nui o ke kinoea PFCS i hoʻohana ʻia i ke kaʻina hana;
· Ka hoʻomaikaʻi ʻana i ka hoʻomaʻemaʻe multi-wafer i ka hoʻomaʻemaʻe hoʻokahi-wafer e hōʻemi i ka nui o nā mea hoʻomaʻemaʻe kemika i hoʻohana ʻia i ka hana hoʻomaʻemaʻe.
· Hoʻomalu kaʻina hana koʻikoʻi:
a. Hoʻomaopopo i ka automation o ke kaʻina hana, hiki ke hoʻomaopopo i ka hoʻoponopono pololei a me ka hana ʻana o ka hui, a hoʻemi i ka hapa nui o ka hana lima;
b. ʻO ke kaʻina hana hoʻomaʻemaʻe ultra-maʻemaʻe, ma kahi o 5% a i ʻole ka liʻiliʻi o ka nalo ʻana e nā kānaka a me ke kaiapuni. Ultra-maʻemaʻe kaʻina kaiapuni kumu nui loa i ka ea maʻemaʻe, kiʻekiʻe-maʻemaʻe wai, compressed ea, CO2, N2, wela, humidity, etc. ʻO ka maʻemaʻe pae o ka hale hana maʻemaʻe e ana pinepine ʻia e ka helu kiʻekiʻe o nā ʻāpana i ʻae ʻia i kēlā me kēia leo o ea, ʻo ia hoʻi, ka helu ʻana o nā ʻāpana;
c. E hoʻoikaika i ka ʻike ʻana, a koho i nā wahi koʻikoʻi kūpono no ka ʻike ʻana ma nā keʻena hana me ka nui o ka ʻōpala i ka wā o ke kaʻina hana.
Welina mai i nā mea kūʻai mai a puni ka honua e kipa mai iā mākou no kahi kūkākūkā hou aku!
https://www.vet-china.com/
https://www.facebook.com/people/Ningbo-Miami-Advanced-Material-Technology-Co-Ltd/100085673110923/
https://www.linkedin.com/company/100890232/admin/page-posts/published/
https://www.youtube.com/@user-oo9nl2qp6j
Ka manawa hoʻouna: ʻAukake-13-2024