Silicon Carbide (SiC) Epitaxial Wafer

Takaitaccen Bayani:

Silicon Carbide (SiC) Epitaxial Wafer daga VET Energy babban kayan aiki ne wanda aka tsara don biyan buƙatun buƙatun ƙarfin ƙarni na gaba da na'urorin RF. VET Energy yana tabbatar da cewa kowane wafer na epitaxial an ƙera shi da kyau don samar da ingantaccen yanayin zafi, rushewar wutar lantarki, da motsi mai ɗaukar kaya, yana mai da shi manufa don aikace-aikace kamar motocin lantarki, sadarwar 5G, da ingantaccen ƙarfin lantarki.


Cikakken Bayani

Tags samfurin

VET Energy silicon carbide (SiC) epitaxial wafer babban aiki ne mai fa'ida mai fa'ida mai ɗaukar hoto tare da kyakkyawan juriya na zafin jiki, mitar mita da manyan halaye masu ƙarfi. Yana da manufa mai mahimmanci don sabon ƙarni na na'urorin lantarki. VET Energy yana amfani da fasahar Epitaxial na MOCVD na ci gaba don haɓaka manyan yadudduka na SiC epitaxial a kan sifofin SiC, yana tabbatar da kyakkyawan aiki da daidaiton wafer.

Mu Silicon Carbide (SiC) Epitaxial Wafer yana ba da kyakkyawar dacewa tare da nau'ikan kayan aikin semiconductor ciki har da Si Wafer, SiC Substrate, SOI Wafer, da SiN Substrate. Tare da ƙaƙƙarfan Layer na epitaxial, yana goyan bayan matakai na ci gaba kamar haɓaka Epi Wafer da haɗin kai tare da kayan kamar Gallium Oxide Ga2O3 da AlN Wafer, yana tabbatar da amfani mai amfani a cikin fasaha daban-daban. An ƙera shi don dacewa da tsarin sarrafa kaset na masana'antu, yana tabbatar da ingantaccen aiki da ingantaccen aiki a cikin mahallin ƙirƙira semiconductor.

Layin samfurin VET Energy baya iyakance ga wafers na SiC epitaxial. Har ila yau, muna samar da nau'o'in nau'i na kayan aiki na semiconductor, ciki har da Si Wafer, SiC Substrate, SOI Wafer, SiN Substrate, Epi Wafer, da dai sauransu. Wafer, don saduwa da buƙatun masana'antar lantarki ta gaba don na'urorin aiki masu girma.

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BAYANIN WAFERING

*n-Pm=n-nau'in Pm-Grade,n-Ps=n-nau'in Ps-Grade,Sl=Semi-lnsulating

Abu

8-inci

6-Inci

4-Inci

nP

n-Pm

n-Ps

SI

SI

TTV(GBIR)

≤6 ku

≤6 ku

Bow(GF3YFCD) - Cikakken Ƙimar

≤15 μm

≤15 μm

≤25μm

≤15 μm

Warp(GF3YFER)

≤25μm

≤25μm

≤40 μm

≤25μm

LTV(SBIR) -10mmx10mm

<2μm

Wafar Edge

Beveling

SURFACI GAME

*n-Pm=n-nau'in Pm-Grade,n-Ps=n-nau'in Ps-Grade,Sl=Semi-lnsulating

Abu

8-inci

6-Inci

4-Inci

nP

n-Pm

n-Ps

SI

SI

Ƙarshen Sama

Yaren mutanen Poland na gani na gefe biyu, Si- Face CMP

SurfaceRoughness

(10um x 10um) Si-FaceRa≤0.2nm
C-Face Ra≤ 0.5nm

(5umx5um) Si-Face Ra≤0.2nm
C-Face Ra≤0.5nm

Kwakwalwa na Edge

Babu Wanda Ya Halatta (tsawo da nisa≥0.5mm)

Indents

Babu Wanda Ya Halatta

Scratches (Si-Face)

Qty.≤5, Taruwa
Length≤0.5× wafer diamita

Qty.≤5, Taruwa
Length≤0.5× wafer diamita

Qty.≤5, Taruwa
Length≤0.5× wafer diamita

Karas

Babu Wanda Ya Halatta

Ƙarƙashin Ƙarfi

3 mm

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