Fan out wafer level packaging (FOWLP) is a cost-effective method in the semiconductor industry. But the typical side effects of this process are warping and chip offset. Despite the continuous impr...
Wang Fuwen, deputy minister of the Ministry of Commerce and deputy representative of international trade negotiations, said at the press conference on the celebration of the 70th anniversary of the...
RWE wants to build about 3GW of hydrogen-fuelled gas-fired power plants in Germany by the end of the century, chief executive Markus Krebber said at the German utility’s annual general meetin...
The Global Carbon Mold Market provides detailed information and overview about the key influential factors required to make well informed business decision. This is a latest report, covering the cu...
As shown in Fig. 3, there are three dominant techniques aiming to provide SiC single crystal with high quality and effciency: liquid phase epitaxy (LPE), physical vapor transport (PVT), and high-te...
The thermal system of the vertical single crystal furnace is also called the thermal field. The function of the graphite thermal field system refers to the entire system for melting silicon materia...