Product Description
Silicon carbide Wafer Boat are widely used as a wafer holder in high temperature diffusion process.
Advantages:
High temperature resistance: normal use at 1800 ℃
High thermal conductivity: equivalent to graphite material
High hardness: hardness second only to diamond, boron nitride
Corrosion resistance: strong acid and alkali have no corrosion to it, the corrosion resistance is better than tungsten carbide and alumina
Light weight: low density, close to aluminum
No deformation: low coefficient of thermal expansion
Thermal shock resistance: it can withstand sharp temperature changes, resist thermal shock, and has stable performance
Physical Properties Of SiC
| Property | Value | Method |
| Density | 3.21 g/cc | Sink-float and dimension |
| Specific heat | 0.66 J/g °K | Pulsed laser flash |
| Flexural strength | 450 MPa560 MPa | 4 point bend, RT4 point bend, 1300° |
| Fracture toughness | 2.94 MPa m1/2 | Microindentation |
| Hardness | 2800 | Vicker’s, 500g load |
| Elastic ModulusYoung’s Modulus | 450 GPa430 GPa | 4 pt bend, RT4 pt bend, 1300 °C |
| Grain size | 2 – 10 µm | SEM |
Thermal Properties Of SiC
| Thermal Conductivity | 250 W/m °K | Laser flash method, RT |
| Thermal Expansion (CTE) | 4.5 x 10-6 °K | Room temp to 950 °C, silica dilatometer |
