SiC Wafer Boat/Tower

Product Detail

Product Description

Silicon carbide Wafer Boat are widely used as a wafer holder in high temperature diffusion process.

Advantages:

High temperature resistance: normal use at 1800 ℃

High thermal conductivity: equivalent to graphite material

High hardness: hardness second only to diamond, boron nitride

Corrosion resistance: strong acid and alkali have no corrosion to it, the corrosion resistance is better than tungsten carbide and alumina

Light weight: low density, close to aluminum

No deformation: low coefficient of thermal expansion

Thermal shock resistance: it can withstand sharp temperature changes, resist thermal shock, and has stable performance

Physical Properties Of SiC

Property	Value	Method
Density	3.21 g/cc	Sink-float and dimension
Specific heat	0.66 J/g °K	Pulsed laser flash
Flexural strength	450 MPa560 MPa	4 point bend, RT4 point bend, 1300°
Fracture toughness	2.94 MPa m1/2	Microindentation
Hardness	2800	Vicker’s, 500g load
Elastic ModulusYoung’s Modulus	450 GPa430 GPa	4 pt bend, RT4 pt bend, 1300 °C
Grain size	2 – 10 µm	SEM