After the wafer has gone through the previous process, the chip preparation is completed, and it needs to be cut to separate the chips on the wafer, and finally packaged. The wafer cutting process ...
Graphite carbon carbon ceramic glass steel fiber composite materials carbon fiber composite materials and other hard and brittle materials, the use of diamond wire cutting processing, get twice the...
The sound of electric furnace steel October 17th: The current price of small-scale resources is close to the level of 2016, and there is support for the price of upstream needle coke, and the profi...
What are the factors that wear alumina ceramic structural parts? Alumina ceramic structure is a very widely used product, the majority of users is its series of superior performance. However, in th...
What are the advantages of flexible graphite paper as sealing material?
Graphite paper is now more and more widely used in high-tech electronics industry. With the development of the market, ...
Silicon carbide (SiC) semiconductor material is the most mature one among the wide band gap semiconductors developed. SiC semiconductor materials have great application potential in high temperatur...