ZogulitsaDkulemba
Boti la Silicon carbide Wafer Boat limagwiritsidwa ntchito kwambiri ngati chofukizira chophikira mumayendedwe otentha kwambiri.
Ubwino:
Kukana kutentha kwakukulu:ntchito yachibadwa pa 1800 ℃
Mkulu matenthedwe madutsidwe:zofanana ndi zinthu za graphite
Kuuma kwakukulu:kuuma kwachiwiri kwa diamondi, boron nitride
Kukana dzimbiri:asidi wamphamvu ndi alkali alibe dzimbiri kwa izo, kukana dzimbiri ndi bwino kuposa tungsten carbide ndi alumina
Kulemera kopepuka:otsika kachulukidwe, pafupi ndi aluminiyamu
Palibe mapindikidwe: otsika coefficient wa kukulitsa matenthedwe
Thermal shock resistance:imatha kupirira kusintha kwakuthwa kwa kutentha, kukana kugwedezeka kwa kutentha, ndipo imakhala ndi ntchito yokhazikika
Mawonekedwe a SiC
Katundu | Mtengo | Njira |
Kuchulukana | 3.21g/cc | Sink-float ndi dimension |
Kutentha kwenikweni | 0.66 J/g °K | Kuwala kwa laser pulsed |
Flexural mphamvu | 450 MPa 560 MPa | 4 point bend, RT4 point bend, 1300° |
Kulimba kwa fracture | 2.94 MPa m1/2 | Microindentation |
Kuuma | 2800 | Vicker, 500g katundu |
Elastic ModulusYoung's Modulus | 450 GPA430 GPA | 4 pt bend, RT4 pt bend, 1300 °C |
Kukula kwambewu | 2 - 10 μm | Mtengo wa SEM |
Thermal Properties of SiC
Thermal Conductivity | 250 W/m °K | Njira ya laser flash, RT |
Kukula kwa Thermal (CTE) | 4.5 x 10-6 °K | Kutentha kwachipinda mpaka 950 ° C, silika dilatometer |