When it semen to business news, understanding the elaborateness of semiconductor fabrication is necessity. semiconductor wafer are crucial component in this industry, but they often face contamination from assorted impurity. These contaminant, include atom, organic matter, metallic element ion, and oxide, can impact the fabrication procedure.
Particles such as polymer and etching impurity trust on intermolecular force to adsorb on the wafer’s surface, affect device photolithography. organic impurities like homo skin oil and machine oil form movie on the wafer, impede cleaning. metallic element ions like iron and aluminum are often remove through the formation of metallic element ion complex. Oxides impede fabrication procedure and are typically remove by soak in dilute hydrofluoric acid.
chemical methods are commonly use to clean and jerk semiconductor wafer. moisture chemical cleaning technique such as solution submergence and mechanical scrub are prevailing. supersonic and megasonic cleaning method offer efficient ways to remove impurity. dry chemical cleaning, include plasma and gas phase technology, also play a function in semiconductor wafer cleaning processes.
Post time: Oct-29-2024