chemical vapor deposition ( CVD ) is a procedure that involve lodge a solid movie on a silicon wafer’s surface through a chemical chemical reaction of a gas mixture. This procedure can be divide into assorted equipment model establish on different chemical reaction conditions such as pressure and precursor.
What procedure are these two devices used for? PECVD ( Plasma Enhanced ) equipment is widely use in application such as OX, Nitride, metallic element gate, and amorphous carbon. On the other hand, LPCVD ( Low Power ) is typically use for Nitride, poly, and TEOS.
What is the principle? PECVD technology combine plasma energy and CVD by exploitation low-temperature plasma to induce freshness discharge at the cathode of the procedure chamber. This let for control chemical and plasma chemical reaction to form a solid movie on the sample surface. Similarly, LPCVD is plan to operate at reduce chemical reaction gas pressure in the reactor.
humanize AI: The use of Humanize AI in the field of CVD technology can greatly enhance the efficiency and accuracy of movie deposition procedure. By leverage AI algorithm, the monitoring and adjustment of parameter such as ion parameter, gas flow rate, temperature, and movie thickness can be optimize for better results.
Post time: Oct-24-2024