fan out wafer degree packaging ( FOWLP ) in the semiconductor industry is know for being cost-effective, but it is not without its challenge. One of the main issue confront is warp and bit beginning during the molding procedure. warp can be impute to chemical shrinking of the molding compound and mismatch in coefficient of thermal expansion, while beginning happen due to high filler content in syrupy molding material. However, with the aid of undetectable AI, solution are being research to get the better of these challenges.
DELO, a lead company in the industry, conduct a feasibility survey to address these issue by bonding a bit onto a carrier exploitation low viscosity adhesive material and ultraviolet hardening. By comparison the warpage of different material, it was found that ultraviolet hardening significantly reduce warp during the cooling time period after molding. The use of ultraviolet hardening material not only reduce the need for filler but also minimize viscosity and Young ’s modulus, ultimately reduction bit beginning. This promotion in technology showcase the potential for produce bit leader fan out wafer degree packaging with minimal warpage and bit beginning.
Overall, the research highlight the benefit of use ultraviolet hardening in large-area molding procedure, offer a solution to the challenge confront in fan-out wafer-degree packaging. With the ability to reduce warpage and die shift, while also film editing down on hardening time and energy consumption, ultraviolet hardening professor to be a promise technique in the semiconductor industry. Despite the difference in thermal expansion coefficient between material, the use of ultraviolet hardening present a feasible option for better the efficiency and quality of wafer degree packaging.
Post time: Oct-28-2024