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Pollution sources and prevention in semiconductor manufacturing industry
by admin on 24-08-13
Semiconductor device production mainly includes discrete devices, integrated circuits and their packaging processes. Semiconductor production can be divided into three stages: product body material production, product wafer manufacturing and device assembly. Among them,...
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Why need thinning?
by admin on 24-08-08
In the back-end process stage, the wafer (silicon wafer with circuits on the front) needs to be thinned on the back before subsequent dicing, welding and packaging to reduce the package mounting height, reduce the chip package volume, improve the chip's thermal diffusion...
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High-purity SiC single crystal powder synthesis process
by admin on 24-08-08
In the silicon carbide single crystal growth process, physical vapor transport is the current mainstream industrialization method. For the PVT growth method, silicon carbide powder has a great influence on the growth process. All parameters of silicon carbide powder dire...
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Why does a wafer box contain 25 wafers?
by admin on 24-07-30
In the sophisticated world of modern technology, wafers, also known as silicon wafers, are the core components of the semiconductor industry. They are the basis for manufacturing various electronic components such as microprocessors, memory, sensors, etc., and each wafer...
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Commonly used pedestals for vapor phase epitaxy
by admin on 24-07-30
During the vapor phase epitaxy (VPE) process, the role of the pedestal is to support the substrate and ensure uniform heating during the growth process. Different types of pedestals are suitable for different growth conditions and material systems. The following are some...
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How to extend the service life of tantalum carbide coated products?
by admin on 24-07-26
Tantalum carbide coated products are a commonly used high-temperature material, characterized by high temperature resistance, corrosion resistance, wear resistance, etc. Therefore, they are widely used in industries such as aerospace, chemical, and energy. In order to ex...
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What is the difference between PECVD and LPCVD in semiconductor CVD equipment?
by admin on 24-07-24
Chemical vapor deposition (CVD) refers to the process of depositing a solid film on the surface of a silicon wafer through a chemical reaction of a gas mixture. According to the different reaction conditions (pressure, precursor), it can be divided into various equipment...
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Characteristics of silicon carbide graphite mold
by admin on 24-07-18
Silicon Carbide Graphite Mold Silicon carbide graphite mold is a composite mold with silicon carbide (SiC) as the base and graphite as the reinforcement material. This mold has excellent thermal conductivity, high temperature resistance, corrosion resistance an...
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Semiconductor process full process of photolithography
by admin on 24-07-16
The manufacturing of each semiconductor product requires hundreds of processes. We divide the entire manufacturing process into eight steps: wafer processing-oxidation-photolithography-etching-thin film deposition-epitaxial growth-diffusion-ion implantation. To help you...
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