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BJT, CMOS, DMOS and other semiconductor process technologies
by admin on 24-09-10
Welcome to our website for product information and consultation. Our website: https://www.vet-china.com/ As semiconductor manufacturing processes continue to make breakthroughs, a famous statement called "Moore's Law" has been circulating in the industry. It was p...
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Semiconductor patterning process flow-etching
by admin on 24-09-10
Early wet etching promoted the development of cleaning or ashing processes. Today, dry etching using plasma has become the mainstream etching process. Plasma consists of electrons, cations and radicals. The energy applied to the plasma causes the outermost electrons of t...
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Research on 8-inch SiC epitaxial furnace and homoepitaxial process-Ⅱ
by admin on 24-09-04
2 Experimental results and discussion 2.1 Epitaxial layer thickness and uniformity Epitaxial layer thickness, doping concentration and uniformity are one of the core indicators for judging the quality of epitaxial wafers. Accurately controllable thickness, doping co...
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Research on 8-inch SiC epitaxial furnace and homoepitaxial process-Ⅰ
by admin on 24-09-04
Currently, the SiC industry is transforming from 150 mm (6 inches) to 200 mm (8 inches). In order to meet the urgent demand for large-size, high-quality SiC homoepitaxial wafers in the industry, 150mm and 200mm 4H-SiC homoepitaxial wafers were successfully prepared on do...
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Optimization of porous carbon pore structure -Ⅱ
by admin on 24-08-27
Welcome to our website for product information and consultation. Our website: https://www.vet-china.com/ Physical and chemical activation method Physical and chemical activation method refers to the method of preparing porous materials by combining the above two acti...
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Optimization of porous carbon pore structure-Ⅰ
by admin on 24-08-27
Welcome to our website for product information and consultation. Our website: https://www.vet-china.com/ This paper analyzes the current activated carbon market, conducts an in-depth analysis of the raw materials of activated carbon, introduces the pore structure...
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Semiconductor process flow-Ⅱ
by admin on 24-08-23
Welcome to our website for product information and consultation. Our website: https://www.vet-china.com/ Etching of Poly and SiO2: After this, the excess Poly and SiO2 are etched away, that is, removed. At this time, directional etching is used. In the classification...
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Semiconductor process flow
by admin on 24-08-23
You can understand it even if you have never studied physics or mathematics, but it is a bit too simple and suitable for beginners. If you want to know more about CMOS, you have to read the content of this issue, because only after understanding the process flow (that is...
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Sources of semiconductor wafer contamination and cleaning
by admin on 24-08-13
Some organic and inorganic substances are required to participate in semiconductor manufacturing. In addition, since the process is always carried out in a clean room with human participation, semiconductor wafers are inevitably contaminated by various impurities. Accor...
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