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Optimization of porous carbon pore structure -Ⅱ
by admin on 24-08-27
Welcome to our website for product information and consultation. Our website: https://www.vet-china.com/ Physical and chemical activation method Physical and chemical activation method refers to the method of preparing porous materials by combining the above two acti...
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Optimization of porous carbon pore structure-Ⅰ
by admin on 24-08-27
Welcome to our website for product information and consultation. Our website: https://www.vet-china.com/ This paper analyzes the current activated carbon market, conducts an in-depth analysis of the raw materials of activated carbon, introduces the pore structure...
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Semiconductor process flow-Ⅱ
by admin on 24-08-23
Welcome to our website for product information and consultation. Our website: https://www.vet-china.com/ Etching of Poly and SiO2: After this, the excess Poly and SiO2 are etched away, that is, removed. At this time, directional etching is used. In the classification...
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Semiconductor process flow
by admin on 24-08-23
You can understand it even if you have never studied physics or mathematics, but it is a bit too simple and suitable for beginners. If you want to know more about CMOS, you have to read the content of this issue, because only after understanding the process flow (that is...
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Sources of semiconductor wafer contamination and cleaning
by admin on 24-08-13
Some organic and inorganic substances are required to participate in semiconductor manufacturing. In addition, since the process is always carried out in a clean room with human participation, semiconductor wafers are inevitably contaminated by various impurities. Accor...
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Pollution sources and prevention in semiconductor manufacturing industry
by admin on 24-08-13
Semiconductor device production mainly includes discrete devices, integrated circuits and their packaging processes. Semiconductor production can be divided into three stages: product body material production, product wafer manufacturing and device assembly. Among them,...
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Why need thinning?
by admin on 24-08-08
In the back-end process stage, the wafer (silicon wafer with circuits on the front) needs to be thinned on the back before subsequent dicing, welding and packaging to reduce the package mounting height, reduce the chip package volume, improve the chip's thermal diffusion...
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High-purity SiC single crystal powder synthesis process
by admin on 24-08-08
In the silicon carbide single crystal growth process, physical vapor transport is the current mainstream industrialization method. For the PVT growth method, silicon carbide powder has a great influence on the growth process. All parameters of silicon carbide powder dire...
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Why does a wafer box contain 25 wafers?
by admin on 24-07-30
In the sophisticated world of modern technology, wafers, also known as silicon wafers, are the core components of the semiconductor industry. They are the basis for manufacturing various electronic components such as microprocessors, memory, sensors, etc., and each wafer...
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