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  • Graphite with TaC coating

    Graphite with TaC coating

      I. Process parameter exploration 1. TaCl5-C3H6-H2-Ar system     2. Deposition temperature: According to the thermodynamic formula, it is calculated that when the temperature is greater than 1273K, the Gibbs free energy of the reaction is very low and the reaction is relatively complete. The rea...
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  • Silicon carbide crystal growth process and equipment technology

    Silicon carbide crystal growth process and equipment technology

      1. SiC crystal growth technology route PVT (sublimation method), HTCVD (high temperature CVD), LPE (liquid phase method) are three common SiC crystal growth methods;   The most recognized method in the industry is the PVT method, and more than 95% of SiC single crystals are grown by the PVT ...
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  • Preparation and Performance Improvement of Porous Silicon Carbon Composite Materials

    Preparation and Performance Improvement of Porous Silicon Carbon Composite Materials

    Lithium-ion batteries are mainly developing in the direction of high energy density. At room temperature, silicon-based negative electrode materials alloy with lithium to produce lithium-rich product Li3.75Si phase, with a specific capacity of up to 3572 mAh/g, which is much higher than the theor...
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  • Thermal Oxidation of Single Crystal Silicon

    Thermal Oxidation of Single Crystal Silicon

    The formation of silicon dioxide on the surface of silicon is called oxidation, and the creation of stable and strongly adherent silicon dioxide led to the birth of silicon integrated circuit planar technology. Although there are many ways to grow silicon dioxide directly on the surface of silico...
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  • UV Processing for Fan-Out Wafer-Level Packaging

    UV Processing for Fan-Out Wafer-Level Packaging

    Fan out wafer level packaging (FOWLP) is a cost-effective method in the semiconductor industry. But the typical side effects of this process are warping and chip offset. Despite the continuous improvement of wafer level and panel level fan out technology, these issues related to molding still exi...
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  • Silicon carbide ceramics: the terminator of photovoltaic quartz components

    Silicon carbide ceramics: the terminator of photovoltaic quartz components

    With the continuous development of today’s world, non-renewable energy is becoming increasingly exhausted, and human society is increasingly urgent to use renewable energy represented by “wind, light, water and nuclear”. Compared with other renewable energy sources, human beings...
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  • Reaction sintering and pressureless sintering silicon carbide ceramic preparation process

    Reaction sintering and pressureless sintering silicon carbide ceramic preparation process

      Reaction sintering The reaction sintering silicon carbide ceramic production process includes ceramic compacting, sintering flux infiltration agent compacting, reaction sintering ceramic product preparation, silicon carbide wood ceramic preparation and other steps. Reaction sintering silicon ...
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  • Silicon carbide ceramics: precision components necessary for semiconductor processes

    Silicon carbide ceramics: precision components necessary for semiconductor processes

    Photolithography technology mainly focuses on using optical systems to expose circuit patterns on silicon wafers. The accuracy of this process directly affects the performance and yield of integrated circuits. As one of the top equipment for chip manufacturing, the lithography machine contains up...
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  • understanding semiconductor wafer contamination and cleaning procedure

    When it semen to business news, understanding the elaborateness of semiconductor fabrication is necessity. semiconductor wafer are crucial component in this industry, but they often face contamination from assorted impurity. These contaminant, include atom, organic matter, metallic element ion, a...
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