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  • Semiconductor process flow

    Semiconductor process flow

    You can understand it even if you have never studied physics or mathematics, but it is a bit too simple and suitable for beginners. If you want to know more about CMOS, you have to read the content of this issue, because only after understanding the process flow (that is...
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  • Sources of semiconductor wafer contamination and cleaning

    Sources of semiconductor wafer contamination and cleaning

    Some organic and inorganic substances are required to participate in semiconductor manufacturing. In addition, since the process is always carried out in a clean room with human participation, semiconductor wafers are inevitably contaminated by various impurities.  Accor...
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  • Pollution sources and prevention in semiconductor manufacturing industry

    Pollution sources and prevention in semiconductor manufacturing industry

    Semiconductor device production mainly includes discrete devices, integrated circuits and their packaging processes. Semiconductor production can be divided into three stages: product body material production, product wafer manufacturing and device assembly. Among them,...
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  • Why need thinning?

    Why need thinning?

    In the back-end process stage, the wafer (silicon wafer with circuits on the front) needs to be thinned on the back before subsequent dicing, welding and packaging to reduce the package mounting height, reduce the chip package volume, improve the chip's thermal diffusion...
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  • High-purity SiC single crystal powder synthesis process

    High-purity SiC single crystal powder synthesis process

    In the silicon carbide single crystal growth process, physical vapor transport is the current mainstream industrialization method. For the PVT growth method, silicon carbide powder has a great influence on the growth process. All parameters of silicon carbide powder dire...
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  • Why does a wafer box contain 25 wafers?

    Why does a wafer box contain 25 wafers?

    In the sophisticated world of modern technology, wafers, also known as silicon wafers, are the core components of the semiconductor industry. They are the basis for manufacturing various electronic components such as microprocessors, memory, sensors, etc., and each wafer...
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  • Commonly used pedestals for vapor phase epitaxy

    Commonly used pedestals for vapor phase epitaxy

    During the vapor phase epitaxy (VPE) process, the role of the pedestal is to support the substrate and ensure uniform heating during the growth process. Different types of pedestals are suitable for different growth conditions and material systems. The following are some...
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  • How to extend the service life of tantalum carbide coated products?

    How to extend the service life of tantalum carbide coated products?

    Tantalum carbide coated products are a commonly used high-temperature material, characterized by high temperature resistance, corrosion resistance, wear resistance, etc. Therefore, they are widely used in industries such as aerospace, chemical, and energy. In order to ex...
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  • What is the difference between PECVD and LPCVD in semiconductor CVD equipment?

    What is the difference between PECVD and LPCVD in semiconductor CVD equipment?

    Chemical vapor deposition (CVD) refers to the process of depositing a solid film on the surface of a silicon wafer through a chemical reaction of a gas mixture. According to the different reaction conditions (pressure, precursor), it can be divided into various equipment...
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