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How do new energy vehicles achieve vacuum assisted braking? | VET Energy
by admin on 24-12-18
New energy vehicles are not equipped with fuel engines, so how do they achieve vacuum-assisted braking during braking? New energy vehicles mainly achieve brake assist through two methods: The first method is to use an electric vacuum booster braking system. This system uses an electric vac...
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Why do we use UV tape for wafer dicing? | VET Energy
by admin on 24-12-16
After the wafer has gone through the previous process, the chip preparation is completed, and it needs to be cut to separate the chips on the wafer, and finally packaged. The wafer cutting process selected for wafers of different thicknesses is also different: ▪ Wafers with a thickness of more ...
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Wafer warpage, what to do?
by admin on 24-12-16
In a certain packaging process, packaging materials with different thermal expansion coefficients are used. During the packaging process, the wafer is placed on the packaging substrate, and then heating and cooling steps are performed to complete the packaging. However, due to the mismatch betwee...
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Why the reaction rate of Si and NaOH is faster than SiO2?
by admin on 24-12-10
Why the reaction rate of silicon and sodium hydroxide can surpass that of silicon dioxide can be analyzed from the following aspects: Difference in chemical bond energy ▪ Reaction of silicon and sodium hydroxide: When silicon reacts with sodium hydroxide, the Si-Si bond energy between silicon ato...
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Why is silicon so hard but so brittle?
by admin on 24-12-10
Silicon is an atomic crystal, whose atoms are connected to each other by covalent bonds, forming a spatial network structure. In this structure, the covalent bonds between atoms are very directional and have high bond energy, which makes silicon show high hardness when resisting external forces t...
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Why do sidewalls bend during dry etching ?
by admin on 24-12-03
Non-uniformity of ion bombardment Dry etching is usually a process that combines physical and chemical effects, in which ion bombardment is an important physical etching method. During the etching process, the incident angle and energy distribution of ions may be uneven. If the ion incid...
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Introduction to three common CVD technologies
by admin on 24-12-03
Chemical vapor deposition (CVD) is the most widely used technology in the semiconductor industry for depositing a variety of materials, including a wide range of insulating materials, most metal materials and metal alloy materials. CVD is a traditional thin film preparation technology. Its princi...
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Can diamond replace other high-power semiconductor devices?
by admin on 24-11-25
As the cornerstone of modern electronic devices, semiconductor materials are undergoing unprecedented changes. Today, diamond is gradually showing its great potential as a fourth-generation semiconductor material with its excellent electrical and thermal properties and stability under extreme con...
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What is the planarization mechanism of CMP?
by admin on 24-11-25
Dual-Damascene is a process technology used to manufacture metal interconnects in integrated circuits. It is a further development of the Damascus process. By forming through holes and grooves at the same time in the same process step and filling them with metal, the integrated manufacturing of m...
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