According to the overall arrangement of the standardization work, 10 mandatory national standard plan items such as the “Graphite Product Energy Consumption Rating” will be published (see Annex 1),...
Fan out wafer level packaging (FOWLP) is a cost-effective method in the semiconductor industry. But the typical side effects of this process are warping and chip offset. Despite the continuous impr...
The report on the Silicon Carbide Coating market provides a bird’s eye view of the current proceeding within the Silicon Carbide Coating market. Further, the report also takes into account the impa...
Industrially, natural graphite is classified into crystalline graphite and cryptocrystalline graphite according to the crystal form. The crystalline graphite is better crystallized, and the crystal...
According to a report released by TrendForce Consulting, as Anson, Infineon and other cooperation projects with automobile and energy manufacturers are clear, the overall SiC power component market...
I. Process parameter exploration
1. TaCl5-C3H6-H2-Ar system
2. Deposition temperature:
According to the thermodynamic formula, it is calculated that when the temperature is greater than 1273K...