Fan out wafer level packaging (FOWLP) is a cost-effective method in the semiconductor industry. But the typical side effects of this process are warping and chip offset. Despite the continuous impr...
Sputtering targets are mainly used in the electronics and information industries, such as integrated circuits, information storage, liquid crystal displays, laser memories, electronic control devic...
The thermal conductivity and electrical conductivity of graphite rods are quite high, and their electrical conductivity is 4 times higher than that of stainless steel, 2 times higher than that of c...
Wafer cutting is one of the important links in power semiconductor production. This step is designed to accurately separate individual integrated circuits or chips from semiconductor wafers.
The ke...
Quality First,and Customer Supreme is our guideline to provide the best service to our customers.Nowadays, we are trying our best to become one of the best exporters in our field to meet customers ...
Why do graphite crucibles crack? How to solve it?
The following is a detailed analysis of the causes of cracks:
1. After the crucible is used for a long time, the crucible wall presents longitudin...