SiC Wafer Nkoj / Ntauwd

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Product Detail

Khoom cim npe

KhoomDsau ntawv

Silicon carbide Wafer Boat yog dav siv los ua tus tuav wafer hauv cov txheej txheem kub diffusion.

Qhov zoo:

Kub kub kuj:ib txwm siv ntawm 1800 ℃

High thermal conductivity:sib npaug rau cov khoom siv graphite

Siab hardness:hardness thib ob tsuas yog pob zeb diamond, boron nitride

Corrosion kuj:muaj zog acid thiab alkali tsis muaj corrosion rau nws, corrosion kuj zoo dua tungsten carbide thiab alumina.

Lub teeb nyhav:tsawg ntom, ze rau aluminium

Tsis muaj deformation: tsawg coefficient ntawm thermal expansion

Thermal shock tsis kam:Nws tuaj yeem tiv taus qhov kub thiab txias hloov, tiv thaiv thermal shock, thiab muaj kev ua haujlwm ruaj khov

 

Physical Properties Of SiC

Khoom Tus nqi Txoj kev
Qhov ntom 3.21 g / cc Sink-float thiab dimension
Tshwj xeeb kub 0.66 J / g ° K Pulsed laser flash
Flexural zog 450 MPa 560 MPa 4 taw tes khoov, RT4 taw tes khoov, 1300 °
Fracture toughness 2.94 MPa m1/2 Microindentation
Hardness 2800 Vicker's, 500g load
Elastic ModulusYoung's Modulus 450 GPa 430 GPa 4 pt khoov, RT4 pt khoov, 1300 ° C
Cov qoob loo loj 2-10 µm SEM

 

Thermal Properties ntawm SiC

Thermal conductivity 250 W / m ° K Laser flash method, RT
Thermal Expansion (CTE) 4.5 x 10-6 ° K Chav ntsuas kub txog 950 ° C, silica dilatometer

 

 

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