The origin of the name epitaxial wafer
First, let’s popularize a small concept: wafer preparation includes two major links: substrate preparation and epitaxial process. The substrate is a wafer m...
Dual-Damascene is a process technology used to manufacture metal interconnects in integrated circuits. It is a further development of the Damascus process. By forming through holes and grooves at t...
QMI adds a new report to its research database entitled “Global Carbon felt & graphite felt Market Research Report.” The report has market size estimation and forecasts have been provided based...
Wide bandgap (WBG) semiconductors represented by silicon carbide (SiC) and gallium nitride (GaN) have received widespread attention. People have high expectations for the application prospects of s...
Taking polyacrylonitrile based carbon felt as an example, the area weight is 500g/m2 and 1000g/m2, the longitudinal and transverse strength (N/mm2) are 0.12, 0.16, 0.10, 0.12, the breaking elongati...