Fan out wafer level packaging (FOWLP) is a cost-effective method in the semiconductor industry. But the typical side effects of this process are warping and chip offset. Despite the continuous impr...
Global Research on “Graphite Crucible Market” Report Covers influencing data of production, Consumption, revenue, Gross margin, Cost, Gross, market share, and CAGR. It provides a detailed investiga...
When silicon carbide crystal grows, the “environment” of the growth interface between the axial center of the crystal and the edge is different, so that the crystal stress on the edge i...
The main functions of silicon carbide boat support and quartz boat support are the same. Silicon carbide boat support has excellent performance but high price. It constitutes an alternative relatio...
Atmospheric pressure sintered silicon carbide is no longer just used as an abrasive, but more as a new material, and is widely used in high-tech products, such as ceramics made of silicon carbide m...
SiC/SiC has excellent heat resistance and will replace superalloy in the application of aero-engine
High thrust-to-weight ratio is the goal of advanced aero-engines. However, with the increase of t...