Introduction
In the metallurgical industry, the use of high-quality materials is paramount to ensure the efficient and reliable production of metals and alloys. Among the various materials employ...
Fan out wafer level packaging (FOWLP) is a cost-effective method in the semiconductor industry. But the typical side effects of this process are warping and chip offset. Despite the continuous impr...
Carbon-carbon composites are a type of carbon fiber composites, with carbon fiber as the reinforcement material and deposited carbon as the matrix material. The matrix of C/C composites is carbon. ...
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Etching of Poly and SiO2:
After this, the excess Poly and SiO2 are etched away, that is,...
The third generation of semiconductors, represented by gallium nitride (GaN) and silicon carbide (SiC), have been rapidly developed due to their excellent properties. However, how to accurately mea...
1. Main processes of plasma enhanced chemical vapor deposition
Plasma enhanced chemical vapor deposition (PECVD) is a new technology for the growth of thin films by chemical reaction of gase...