Graphite mold/Jigs /fixture for Semiconductor Encapsulations by Glass-to-Metal Sealing

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Graphite mold/Jigs /fixture for Semiconductor Encapsulations by Glass-to-Metal Sealing

 

Characteristics of our graphite mold:

1. Graphite molds are one of the most heat-resistant materials at present.

2. With good thermal shock resistance, no cracks will occur when the temperature is hot and cold

3. Excellent thermal conductivity and conductive properties

4. Good lubrication and abrasion resistance

5. Chemical stability, acid and alkali resistance and corrosion resistance, not easy to react with most metals

6. Factory supply customized graphite sintering mold Easy to process, good mechanical processing performance, can machining complex shape and high precision mold
Application

The graphite mold has been widely used in following aspects:

1.Continuous casting mold

2.Pressure foundry mold

3.Glass molding with die

4.Sintering mold

5.Centrifugal casting mold

6.Smelt gold, silver, jewelry……

 

Grain Size
(μm)
25 25 25 25
Bulk Density
(≥g/cm3)
1.8 1.8 1.85 1.85
Compressive Strength
(≥MPa)
60 60 70 70
Flexural Strength
(≥MPa)
30 30 35 35
Porosity
(≤%)
21 21 18 18
Specific Resistance 
(≤μΩm)
12 12 12 12
Ash Content
(≤%)
0.08 0.08 0.08 0.08
Shore Hardness 48 48 50 50

 Graphite mold/Jigs /fixture for Semiconductor Encapsulations by Glass-to-Metal SealingGraphite mold/Jigs /fixture for Semiconductor Encapsulations by Glass-to-Metal SealingGraphite mold/Jigs /fixture for Semiconductor Encapsulations by Glass-to-Metal SealingGraphite mold/Jigs /fixture for Semiconductor Encapsulations by Glass-to-Metal SealingGraphite mold/Jigs /fixture for Semiconductor Encapsulations by Glass-to-Metal Sealing

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Graphite mold/Jigs /fixture for Semiconductor Encapsulations by Glass-to-Metal Sealing


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