After the wafer has gone through the previous process, the chip preparation is completed, and it needs to be cut to separate the chips on the wafer, and finally packaged. The wafer cutting process ...
SiC coated graphite bases are commonly used to support and heat single crystal substrates in metal-organic chemical vapor deposition (MOCVD) equipment. The thermal stability, thermal uniformity and...
The preferred material for precision parts of photolithography machines
In the semiconductor field, silicon carbide ceramic materials are mainly used in key equipment for integrated circuit manuf...
Fan out wafer level packaging (FOWLP) is a cost-effective method in the semiconductor industry. But the typical side effects of this process are warping and chip offset. Despite the continuous impr...
Graphite Bearing is made by Electro-Graphite, Carbon Graphite, Metal Graphite, and Resin-Bonded Graphit, Two types are incluided that are Radial Bearing and Axial Bearing.
The global Graphite Beari...
Manufacturing method of graphite heating rod in vacuum furnace
Vacuum furnace graphite rod is also called vacuum furnace graphite heating rod. In the early days, people turned graphite into c...