As the basis of modern electronic devices, semiconductor material are undergo unprecedented change. today, diamond is gradually screening its great potential as a fourth-coevals semiconductor mater...
Fan out wafer level packaging (FOWLP) is a cost-effective method in the semiconductor industry. But the typical side effects of this process are warping and chip offset. Despite the continuous impr...
Sichuan Province is vast in area and rich in mineral resources. Among them, the prospecting potential of emerging strategic resources is huge. A few days ago, it was led by Sichuan Natural Resourc...
The Italian Ministry of Infrastructure and Transport will allocate 300 million euros ($328.5 million) from Italy’s post-pandemic economic recovery Plan to promote a new plan to replace diesel...
Material properties under friction, wear and high temperature environments are increasingly demanding, and the emergence of press-free sintered silicon carbide materials provides us with an innovat...
At present, many countries around all aspects of the new hydrogen research is in full swing, technical difficulties in stepping up to overcome. With the continuous expansion of the scale of hydroge...