fan out wafer degree packaging ( FOWLP ) in the semiconductor industry is know for being cost-effective, but it is not without its challenge. One of the main issue confront is warp and bit beginni...
The development of a quantum computer that can solve problems, which classical computers can only solve with great effort or not at all—this is the goal currently being pursued by an ever-growing n...
First of all, we need to know PECVD (Plasma Enhanced Chemical Vapor Deposition). Plasma is the intensification of the thermal motion of material molecules. The collision between them will cause the...
Electric Zhixin news, on the evening of November 13, Jianruiwo can issue a notice saying that the Shenzhen Intermediate People’s Court ruled on November 7, 2019 that Huang Ziting had applied ...
Tantalum carbide hardness, high melting point, high temperature performance, mainly used as a cemented carbide additive. The thermal hardness, thermal shock resistance and thermal oxidation resista...
The rising price of raw materials is the main driver of the recent price rise of graphite electrode products. the background of the national “carbon neutralization” target and the stric...