The manufacturing of each semiconductor product requires hundreds of processes. We divide the entire manufacturing process into eight steps: wafer processing-oxidation-photolithography-etching-thin...
Silicon carbide covalent bond is very strong, still has high strength bonding at high temperature, this structural characteristic gives silicon carbide ceramics excellent strength, high hardness, w...
Fan out wafer level packaging (FOWLP) is a cost-effective method in the semiconductor industry. But the typical side effects of this process are warping and chip offset. Despite the continuous impr...
A semiconductor is a material whose electrical conductivity at room temperature is between that of a conductor and an insulator. Like copper wire in everyday life, aluminum wire is a conductor, and...
Graphite electrode is mainly used in EAF steelmaking. Electric furnace steelmaking is to use graphite electrode to introduce current into the furnace. The strong current generates arc discharge thr...
Wafer cutting is one of the important links in power semiconductor production. This step is designed to accurately separate individual integrated circuits or chips from semiconductor wafers.
The ke...