Wafer cutting is one of the important links in power semiconductor production. This step is designed to accurately separate individual integrated circuits or chips from semiconductor wafers.
The ke...
GDE is the abbreviation of the gas diffusion electrode, which means the gas diffusion electrode. In the process of manufacturing, the catalyst is coated on the gas diffusion layer as the supporting...
Sputtering targets are mainly used in the electronics and information industries, such as integrated circuits, information storage, liquid crystal displays, laser memories, electronic control devic...
Introduction of Silicon Carbide
Silicon carbide (SIC) has a density of 3.2g/cm3. Natural silicon carbide is very rare and is mainly synthesized by artificial method. According to the different clas...
fan out wafer degree packaging ( FOWLP ) in the semiconductor industry is know for being cost-effective, but it is not without its challenge. One of the main issue confront is warp and bit beginni...