fan out wafer degree packaging ( FOWLP ) in the semiconductor industry is know for being cost-effective, but it is not without its challenge. One of the main issue confront is warp and bit beginni...
Silicon carbide covalent bond is very strong, still has high strength bonding at high temperature, this structural characteristic gives silicon carbide ceramics excellent strength, high hardness, w...
The technical difficulties in stably mass-producing high-quality silicon carbide wafers with stable performance include:
1) Since crystals need to grow in a high-temperature sealed environment a...
Metal-organic chemical vapor deposition (MOCVD) is a commonly used semiconductor epitaxy technique used to deposit multilayer films on the surface of semiconductor wafers to prepare high-quality se...
Overview of Carbon-Carbon Composite Materials
Carbon/carbon (C/C) composite material is a carbon fiber reinforced composite material with a series of excellent properties such as high strength and ...
GDE is the abbreviation of the gas diffusion electrode, which means the gas diffusion electrode. In the process of manufacturing, the catalyst is coated on the gas diffusion layer as the supporting...