Fan out wafer level packaging (FOWLP) is a cost-effective method in the semiconductor industry. But the typical side effects of this process are warping and chip offset. Despite the continuous impr...
The core technology for the growth of SiC epitaxial materials is firstly defect control technology, especially for defect control technology that is prone to device failure or reliability degradati...
The carbon content of each sintered specimen fracture is different, with a carbon content of A-2.5 awt.% in this range, forming a dense material with almost no pores, which is composed of uniformly...
With the Korean government’s hydrogen bus supply support project, more and more people will have access to hydrogen buses powered by clean hydrogen energy.
On April 18, 2023, the Ministry of ...
“Magic material” graphene can be used for rapid and accurate detection of COVID-19
According to foreign media reports, researchers at the University of Illinois at Chicago have succ...
AEM is to some extent a hybrid of PEM and traditional diaphragm based lye electrolysis. The principle of AEM electrolytic cell is shown in Figure 3. At the cathode, water is reduced to produce hydr...