First of all, we need to know PECVD (Plasma Enhanced Chemical Vapor Deposition). Plasma is the intensification of the thermal motion of material molecules. The collision between them will cause the...
Tantalum carbide hardness, high melting point, high temperature performance, mainly used as a cemented carbide additive. The thermal hardness, thermal shock resistance and thermal oxidation resista...
1, Czochra monocrystalline silicon thermal field and polycrystalline silicon ingot furnace heater:
In the thermal field of czochralcian monocrystalline silicon, there are about 30 kinds of isostat...
Members of the European Parliament and the Council of the European Union have agreed on a new law requiring a dramatic increase in the number of charging points and refueling stations for electric ...
Fan out wafer level packaging (FOWLP) is a cost-effective method in the semiconductor industry. But the typical side effects of this process are warping and chip offset. Despite the continuous impr...
In the back-end process stage, the wafer (silicon wafer with circuits on the front) needs to be thinned on the back before subsequent dicing, welding and packaging to reduce the package mounting he...