Dual-Damascene is a process technology used to manufacture metal interconnects in integrated circuits. It is a further development of the Damascus process. By forming through holes and grooves at t...
In the back-end process stage, the wafer (silicon wafer with circuits on the front) needs to be thinned on the back before subsequent dicing, welding and packaging to reduce the package mounting he...
1. Prepare the pressure valve and carbon fiber cylinder
2. Install the pressure valve on the carbon fiber cylinder and tighten it clockwise, which can be reinforced with an adjustable wrench ...
The 2020 comprehensive silicon carbide composite material market development research report will be classified in the aspects of application, definition, structure and industry. In general, buy an...
Recently, Yadi and the People’s Daily launched the “Who is Chinese?” public welfare micro-video, the emergence of the Yadi graphene technical engineer. Through more than three yea...