Advantages of LMJ processing
The inherent defects of regular laser processing can be overcome by the smart use of laser Laser micro jet (LMJ) technology to propagate the optical characteristics of water and air. This technology allows the laser pulses fully reflected in the processed high purity water jet in an undisturbed manner to reach the machining surface as in optical fiber. From the perspective of use, the main characteristics of LMJ technology are as follows:
1.The laser beam is a columnar (parallel) structure.
2.The laser pulse is transmitted in the waterjet like optical fiber, which is protected from any environmental interference.
3.The laser beam is focused in the LMJ equipment, and there is no change in the height of the machined surface during the whole machining process, so that there is no need to continuously focus with the change of processing depth during the machining process.
4.In addition to the ablation of the work piece material happened during each laser pulses, about 99% of the time in each single unit time from the beginning of each pulse to the next pulse, the processed material is in real-time cooling of water, thus almost erasing the heat-affected zone and remelting layer, but maintaining the high efficiency of processing.
5.Keep cleaning the processed surface.
General specification |
LCSA-100 |
LCSA-200 |
Countertop volume |
125 x 200 x 100 |
460×460×300 |
Linear axis XY |
Linear motor. Linear motor |
Linear motor. Linear motor |
Linear axis Z |
100 |
300 |
Positioning accuracy μm |
+ / - 5 |
+ / - 3 |
Repeated positioning accuracy μm |
+ / - 2 |
+ / - 1 |
Acceleration G |
0.5 |
1 |
Numerical control |
3-axis |
3-axis |
Laser |
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|
Laser type |
DPSS Nd: YAG |
DPSS Nd: YAG, pulse |
Wavelength nm |
532/1064 |
532/1064 |
Rated power W |
50/100/200 |
200/400 |
Water jet |
|
|
Nozzle diameter μm |
25-80 |
25-80 |
Nozzle pressure bar |
100-600 |
0-600 |
Size/Weight |
|
|
Dimensions (Machine) (W x L x H) |
1050 x 800 x 1870 |
1200 x 1200 x 2000 |
Dimensions (control cabinet) (W x L x H) |
700 x 2300 x 1600 |
700 x 2300 x 1600 |
Weight (equipment) kg |
1170 |
2500-3000 |
Weight (control cabinet) kg |
700-750 |
700-750 |
Comprehensive energy consumption |
|
|
Input |
AC 230 V +6%/ -10%, unidirectional 50/60 Hz ±1% |
AC 400 V +6%/-10%, 3-phase50/60 Hz ±1% |
Peak value |
2.5kVA |
2.5kVA |
Join |
10 m power cable: P+N+E, 1.5 mm2 |
10 m power cable: P+N+E, 1.5 mm2 |
Semiconductor industry user application range |
≤4 inches round ingot ≤4 inches ingot slices ≤4 inches ingot scribing
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≤6 inches round ingot ≤6 inch ingot slices ≤6 inches ingot scribing The machine meets the 8-inch circular/slicing/slicing theoretical value, and the specific practical results need to be optimized cutting strategy |