We use time- and angle-resolved photoemission spectroscopy (tr-ARPES) to investigate ultrafast charge transfer in an epitaxial heterostructure made of monolayer WS2 and graphene. This heterostructu...
Wafer cutting is one of the important links in power semiconductor production. This step is designed to accurately separate individual integrated circuits or chips from semiconductor wafers.
The ke...
Thin film deposition is to coat a layer of film on the main substrate material of the semiconductor. This film can be made of various materials, such as insulating compound silicon dioxide, semicon...
Silicon carbide covalent bond is very strong, still has high strength bonding at high temperature, this structural characteristic gives silicon carbide ceramics excellent strength, high hardness, w...
Silicon Carbide is a hard compound containing silicon and carbon, and is found in nature as the extremely rare mineral moissanite. Silicon carbide particles can be bonded together by sintering to f...
As a new type of semiconductor material, SiC has become the most important semiconductor material for the manufacture of short-wavelength optoelectronic devices, high temperature devices, radiation...