Ezweni eliyinkimbinkimbi yobuchwepheshe besimanje,izinkwa eziwucwecwe, eyaziwa nangokuthi ama-silicon wafers, ayizici ezibalulekile embonini ye-semiconductor. Ziyisisekelo sokukhiqiza izingxenye ezahlukene ze-elekthronikhi ezifana nama-microprocessors, inkumbulo, izinzwa, njll., futhi i-wafer ngayinye ithwala amandla ezinto eziningi ze-elekthronikhi. Pho kungani sivame ukubona ama-wafer angama-25 ebhokisini? Empeleni kukhona ukucatshangelwa kwesayensi kanye nezomnotho zokukhiqizwa kwezimboni ngemuva kwalokhu.
Iveza isizathu sokuthi kungani kunamawafa angama-25 ebhokisini
Okokuqala, qonda ubukhulu be-wafer. Amasayizi amawafa ajwayelekile ngokuvamile angama-intshi angu-12 nama-intshi angu-15, okuwukujwayelana nezisetshenziswa zokukhiqiza ezihlukene nezinqubo.Ama-wafers angama-intshi angu-12okwamanje ziwuhlobo oluvame kakhulu ngoba zingakwazi ukuthwala ama-chips amaningi futhi zilinganisela ngokuqhathaniswa ezindlekweni zokukhiqiza nokusebenza kahle.
Inombolo "25 izingcezu" akuyona ngengozi. Isekelwe endleleni yokusika nokusebenza kahle kokupakishwa kwe-wafer. Ngemuva kokukhiqizwa kwe-wafer ngayinye, idinga ukusikwa ukuze yakhe ama-chips amaningi azimele. Ngokuvamile, aI-wafer engu-12-intshiingasika amakhulu noma izinkulungwane zama-chips. Kodwa-ke, ukuze kube lula ukuphatha nokuhamba, lawa ma-chips avame ukupakishwa ngenani elithile, futhi izingcezu ezingama-25 ziyinketho evamile yobuningi ngoba ayinkulu kakhulu futhi ayinkulu kakhulu, futhi ingaqinisekisa ukuzinza okwanele ngesikhathi sokuthutha.
Ngaphezu kwalokho, inani lezingcezu ezingama-25 libuye libe usizo ekuzishintsheni nasekuthuthukisweni komugqa wokukhiqiza. Ukukhiqizwa kweqoqo kunganciphisa izindleko zokucubungula ucezu olulodwa futhi kuthuthukise ukusebenza kahle kokukhiqiza. Ngesikhathi esifanayo, ukugcinwa nokuthutha, ibhokisi le-wafer elinezicucu ezingu-25 kulula ukusebenza futhi linciphisa ingozi yokuphuka.
Kuyaphawuleka ukuthi ngokuthuthuka kobuchwepheshe, eminye imikhiqizo ephezulu ingase yamukele inani elikhulu lamaphakheji, njengezingcezu eziyi-100 noma ezingu-200, ukuze kuthuthukiswe ukusebenza kahle kokukhiqiza. Kodwa-ke, emikhiqizweni eminingi yebanga labathengi kanye nebanga eliphakathi, ibhokisi le-wafer elinezingcezu ezingama-25 lisewukucushwa okuvamile okujwayelekile.
Kafushane, ibhokisi lama-wafers livamise ukuqukatha izingcezu ezingama-25, okuyibhalansi etholwa imboni ye-semiconductor phakathi kokusebenza kahle kokukhiqiza, ukulawula izindleko kanye nokunethezeka kwezinto. Ngokuthuthuka okuqhubekayo kobuchwepheshe, le nombolo ingase ilungiswe, kodwa ingqondo eyisisekelo ngemuva kwayo - ukuthuthukisa izinqubo zokukhiqiza nokuthuthukisa izinzuzo zezomnotho - ihlala ingashintshile.
Ama-wafer ama-intshi angu-12 asebenzisa i-FOUP ne-FOSB, kanti ama-intshi angu-8 nangaphansi (okuhlanganisa no-8-intshi) asebenzisa i-Cassette, i-SMIF POD, kanye nebhokisi lesikebhe esiyisicwecwana, okungukuthi, i-12-intshi.umthwali we-waferngokuhlanganyela ibizwa nge-FOUP, kanye ne-8-inchumthwali we-waferngokuhlanganyela ibizwa ngokuthi Ikhasethi. Ngokuvamile, i-FOUP engenalutho inesisindo esingaba ngu-4.2 kg, kanti i-FOUP egcwele ama-wafer angu-25 inesisindo esingaba ngu-7.3 kg.
Ngokocwaningo kanye nezibalo zethimba labacwaningi be-QYResearch, ukuthengiswa kwemakethe yamabhokisi e-wafer emhlabeni wonke kufinyelele kuma-yuan ayizigidi eziyizinkulungwane ezingu-4.8 ngo-2022, futhi kulindeleke ukuthi kufinyelele kuma-yuan ayizigidi eziyizinkulungwane ezingu-7.7 ngo-2029, ngenani lokukhula elihlanganisiwe lonyaka (CAGR) lika-7.9%. Mayelana nohlobo lomkhiqizo, i-semiconductor FOUP ithatha isabelo esikhulu kunazo zonke emakethe yonke, cishe ama-73%. Mayelana nokusetshenziswa komkhiqizo, isicelo esikhulu kunazo zonke ama-wafers angu-12-intshi, alandelwe ama-wafers angu-8-intshi.
Eqinisweni, kunezinhlobo eziningi zezithwali ezilucwecwana, njenge-FOUP yokudluliswa kwe-wafer ezitshalweni zokukhiqiza ama-wafer; I-FOSB yokuthutha phakathi kokukhiqizwa kwe-silicon wafer kanye nezitshalo zokukhiqiza ama-wafer; Abathwali be-CASSETTE bangasetshenziselwa ukuthutha phakathi kwenqubo futhi basebenzise ngokuhambisana nezinqubo.
VULA AMAKHASETHI
I-OPEN CASSETTE isetshenziswa kakhulu ekuthuthweni kwezinqubo phakathi kwezinqubo kanye nezinqubo zokuhlanza ekukhiqizeni ama-wafer. Njenge-FOSB, i-FOUP nezinye izithwali, ngokuvamile isebenzisa izinto ezimelana nezinga lokushisa, ezinezakhiwo ezinhle kakhulu zemishini, ukuqina kwe-dimensional, futhi ezihlala isikhathi eside, ezimelene ne-static, ezikhipha umoya ophansi, imvula ephansi, futhi zigaywa kabusha. Amasayizi ama-wafer ahlukene, ama-process node, nezinto ezikhethelwe izinqubo ezahlukene zihlukile. Izinto ezijwayelekile ziyi-PFA, PTFE, PP, PEEK, PES, PC, PBT, PEI, COP, njll. Umkhiqizo ngokuvamile uklanywe ngomthamo wezingcezu ezingu-25.
VULA AMAKHASETHI angasetshenziswa ngokuhambisana nokuhambisanayoIkhasethi le-Waferimikhiqizo yokugcina i-wafer kanye nokuthutha phakathi kwezinqubo zokunciphisa ukungcoliswa kwe-wafer.
I-OPEN CASSETTE isetshenziswa ngokuhambisana nemikhiqizo eyenziwe ngokwezifiso ye-Wafer Pod (OHT), engasetshenziswa ekudluliselweni okuzenzakalelayo, ukufinyelela okuzenzakalelayo kanye nokugcinwa okuvalwe kakhudlwana phakathi kwezinqubo zokukhiqiza ama-wafer kanye nokukhiqizwa kwama-chip.
Impela, I-OPEN CASSETTE ingenziwa ngokuqondile emikhiqizweni ye-CASSETTE. I-Wafer Shipping Boxes yomkhiqizo inesakhiwo esinjalo, njengoba kukhonjisiwe esithombeni esingezansi. Ingakwazi ukuhlangabezana nezidingo zokuhamba kwe-wafer kusuka ezitshalweni zokukhiqiza ama-wafer kuya ezitshalweni zokukhiqiza ama-chip. I-CASSETTE neminye imikhiqizo etholakala kuyo ingahlangabezana ngokuyisisekelo nezidingo zokudlulisa, ukugcinwa kanye nokuhamba phakathi kwamafekthri phakathi kwezinqubo ezihlukahlukene ezimbonini eziwucwecwe nezimboni zama-chip.
Ibhokisi Lokuthumela Eliyisilutshwana Esivula Ngaphambili iFOSB
Ibhokisi Lokuthumela Eliyisilutshwana Esivula Ngaphambili I-FOSB isetshenziselwa kakhulu ukuthutha amawafa angama-intshi angu-12 phakathi kwezitshalo ezikhiqiza i-wafer kanye nezitshalo zokukhiqiza ama-chip. Ngenxa yobukhulu obukhulu bama-wafers kanye nezidingo eziphakeme zokuhlanzeka; izingcezu zokuma okukhethekile kanye nomklamo we-shockproof zisetshenziselwa ukunciphisa ukungcola okukhiqizwa ukungqubuzana kokususwa kwe-wafer; izinto zokusetshenziswa zenziwe ngezinto ezikhipha umoya omncane, ezinganciphisa ubungozi bokuphuma kwegesi okungcolisa amawafa. Uma kuqhathaniswa namanye amabhokisi amawafa ezokuthutha, i-FOSB inokuqina komoya okungcono. Ngaphezu kwalokho, efekthri yomugqa wokupakisha ongemuva, i-FOSB ingaphinda isetshenziselwe ukugcinwa nokudlulisa ama-wafers phakathi kwezinqubo ezahlukahlukene.
I-FOSB ngokuvamile yenziwa izingcezu ezingu-25. Ngokungeziwe ekugcinweni okuzenzakalelayo nokubuyiswa nge-Automated Material Handling System (AMHS), ingaphinda isetshenziswe mathupha.
Ukuvula Ngaphambili IPod Ehlanganisiwe
I-Front Opening Unified Pod (FOUP) isetshenziselwa ikakhulukazi ukuvikela, ukuthutha kanye nokugcinwa kwama-wafers embonini ye-Fab. Kuyisitsha esibalulekile senkampani yenethiwekhi yesistimu yokudlulisa ezenzakalelayo embonini ye-wafer engama-intshi angu-12. Umsebenzi wayo obaluleke kakhulu uwukuqinisekisa ukuthi zonke izinkwa eziwu-25 zivikelwe yiyo ukuze zigweme ukungcoliswa uthuli endaweni yangaphandle ngesikhathi sokudlulisa phakathi komshini ngamunye wokukhiqiza, ngaleyo ndlela kuthinte isivuno. I-FOUP ngayinye inamapuleti okuxhuma ahlukahlukene, izikhonkwane nezimbobo ukuze i-FOUP ibe sesikhungweni sokulayisha futhi isetshenziswa yi-AMHS. Isebenzisa izinto eziphansi ezikhipha igesi kanye nezinto eziphansi zokumunca umswakama, ezinganciphisa kakhulu ukukhululwa kwezinhlanganisela eziphilayo futhi kuvimbele ukungcoliswa kwe-wafer; ngesikhathi esifanayo, umsebenzi omuhle kakhulu wokuvala kanye nokwehla kwamandla emali unganikeza indawo yomswakama ophansi we-wafer. Ngaphezu kwalokho, i-FOUP ingaklanywa ngemibala ehlukene, njengobomvu, owolintshi, omnyama, obala, njll., ukuze ihlangabezane nezidingo zenqubo futhi ihlukanise izinqubo nezinqubo ezahlukene; ngokuvamile, i-FOUP yenziwe ngokwezifiso ngamakhasimende ngokuya ngomugqa wokukhiqiza kanye nomehluko womshini wefektri ye-Fab.
Ngaphezu kwalokho, i-POUP ingenziwa ngendlela oyifisayo ibe imikhiqizo ekhethekile yabakhiqizi bokupakisha ngokwezinqubo ezahlukene ezifana ne-TSV kanye ne-FAN OUT ekufakweni kwe-chip back-end, njenge-SLOT FOUP, 297mm FOUP, njll. I-FOUP ingagaywa kabusha, futhi ubude bayo bempilo phakathi kweminyaka engu-2-4. Abakhiqizi be-FOUP bangahlinzeka ngezinsizakalo zokuhlanza umkhiqizo ukuze bahlangabezane nemikhiqizo engcolile ezophinda isetshenziswe.
Abathumeli be-Wafer Evundlile abangathinteki
Abathumeli be-Wafer Evundlile abangenakuthinta basetshenziswa kakhulu ekuthuthweni kwamawafa aqediwe, njengoba kukhonjisiwe emfanekisweni ongezansi. Ibhokisi lokuthutha le-Entegris lisebenzisa indandatho yokusekela ukuze kuqinisekiswe ukuthi ama-wafers awaxhumani ngesikhathi sokugcinwa nokuthutha, futhi anokubekwa uphawu okuhle ukuvimbela ukungcoliswa kokungcola, ukuguga, ukungqubuzana, ukuklwebheka, ukukhipha umoya, njll. Umkhiqizo ulungele kakhulu i-Thin 3D, ilensi noma ama-wafers ama-bumped, futhi izindawo zayo zokusebenza zifaka i-3D, i-2.5D, i-MEMS, i-LED kanye nama-semiconductors amandla. Umkhiqizo ufakwe izindandatho zokusekela ezingama-26, ezinamandla angama-25 (nobukhulu obuhlukahlukene), futhi osayizi be-wafer bahlanganisa u-150mm, 200mm no-300mm.
Isikhathi sokuthumela: Jul-30-2024