Kungani sisebenzisa itheyiphu ye-UV ukwenza ukudayela kwe-wafer? | Amandla we-VET

Ngemva kweisilucwecwanaidlule inqubo yangaphambilini, ukulungiswa kwe-chip kuqediwe, futhi idinga ukusikwa ukuze kuhlukaniswe ama-chips ku-wafer, futhi ekugcineni ihlanganiswe. Iisilucwecwanainqubo yokusika ekhethelwe ama-wafers anobukhulu obuhlukahlukene nayo ihlukile:

▪Ama-wafersenogqinsi olungaphezu kuka-100um ngokuvamile asikwa ngezindwani;

▪Ama-wafersenogqinsi olungaphansi kuka-100um ngokuvamile asikwa ngamalaser. Ukusika i-laser kunganciphisa izinkinga zokucwecwa nokuqhekeka, kodwa uma kungaphezu kuka-100um, ukusebenza kahle kokukhiqiza kuzoncipha kakhulu;

▪Ama-wafersngogqinsi olungaphansi kwama-30um asikwa nge-plasma. Ukusika kwe-plasma kuyashesha futhi ngeke kulimaze ubuso be-wafer, ngaleyo ndlela kuthuthukise isivuno, kodwa inqubo yayo iyinkimbinkimbi kakhulu;

Phakathi nenqubo yokusika i-wafer, ifilimu izofakwa ku-wafer kusengaphambili ukuze kuqinisekiswe "ukucula" okuphephile. Imisebenzi yayo eyinhloko imi kanje.

Lungisa futhi uvikele isinkwa esilucwecwana

Ngesikhathi sokusebenza kwe-dicing, i-wafer idinga ukusikwa ngokunembile.Ama-waferszivame ukuba mncane futhi zishwabene. Itheyiphu ye-UV inganamathisela ngokuqinile i-wafer kuhlaka noma isiteji se-wafer ukuvimbela i-wafer ukuthi ingaguquki futhi inyakaze phakathi nenqubo yokusika, iqinisekisa ukunemba nokunemba kokusika.
Inganikeza ukuvikeleka okuhle ngokomzimba kwe-wafer, ukugwema ukulimalaisilucwecwanaokubangelwa umthelela wamandla angaphandle kanye nokungqubuzana okungenzeka phakathi nenqubo yokusika, njengokuqhekeka, ukuwa konqenqema nokunye ukukhubazeka, futhi kuvikelwe ukwakheka kwe-chip kanye nesekethe ebusweni bewafa.

Ukusebenza okulula kokusika

Itheyiphu ye-UV inokunwebeka nokuguquguquka okufanele, futhi ingakhubaza ngokusesilinganisweni lapho i-blade yokusika ingena, okwenza inqubo yokusika ibe bushelelezi, inciphise imiphumela emibi yokusika ukumelana ne-blade ne-wafer, futhi isiza ukuthuthukisa ikhwalithi yokusika kanye nempilo yesevisi i-blade. Izici zayo ezingaphezulu zenza imfucumfucu ekhiqizwe ukusika inamathele ku-tape kangcono ngaphandle kokuchafaza nxazonke, okulungele ukuhlanzwa okulandelayo kwendawo yokusika, ukugcina indawo yokusebenza ihlanzekile, futhi igweme imfucumfucu ekungcoliseni noma ekuphazamiseni isicwecwe nezinye izinto zokusebenza. .

Kulula ukuphatha kamuva

Ngemuva kokusikwa kwe-wafer, i-tape ye-UV ingancishiswa ngokushesha ku-viscosity noma ilahlekelwe ngokuphelele ngokuyikhanyisa ngokukhanya kwe-ultraviolet yobude obuthile nokuqina, ukuze i-chip enqunyiwe ihlukaniswe kalula ne-tape, elungele okulandelayo. ukupakishwa kwe-chip, ukuhlola nokunye ukugeleza kwenqubo, futhi le nqubo yokuhlukanisa inengozi ephansi kakhulu yokulimaza i-chip.