Ezinye izinto ze-organic kanye ne-inorganic ziyadingeka ukuze ubambe iqhaza ekwenziweni kwe-semiconductor. Ngaphezu kwalokho, njengoba inqubo ihlale yenziwa ekamelweni elihlanzekile ngokuhlanganyela komuntu, i-semiconductorizinkwa eziwucwecwenakanjani zingcoliswe ukungcola okuhlukahlukene.
Ngokusho komthombo kanye nemvelo yezinto ezingcolile, zingahlukaniswa cishe zibe izigaba ezine: izinhlayiya, izinto eziphilayo, i-ion yensimbi nama-oxides.
1. Izinhlayiya:
Izinhlayiya ikakhulukazi ezinye polymers, photoresists kanye etching ukungcola.
Ukungcola okunjalo kuvame ukuncika emandleni e-intermolecular ukukhangisa ebusweni bewafa, okuthinta ukwakheka kwezibalo zejiyomethri namapharamitha kagesi wenqubo ye-photolithography yedivayisi.
Ukungcola okunjalo kususwa ngokuyinhloko ngokunciphisa kancane kancane indawo yabo yokuxhumana nobuso beisilucwecwanangokusebenzisa izindlela ezingokomzimba noma zamakhemikhali.
2. Izinto eziphilayo:
Imithombo yokungcola okuphilayo ibanzi ngokuqhathaniswa, njengamafutha esikhumba somuntu, amagciwane, uwoyela womshini, i-vacuum grease, i-photoresist, izihlanzi zokuhlanza, njll.
Ukungcola okunjalo kuvame ukwenza ifilimu ephilayo ebusweni be-wafer ukuvimbela uketshezi lokuhlanza ukuthi lufinyelele phezulu kwe-wafer, okuholela ekuhlanzeni okungaphelele kwendawo eyisicwecwana.
Ukususwa kokungcola okunjalo kuvame ukwenziwa esinyathelweni sokuqala senqubo yokuhlanza, ikakhulukazi kusetshenziswa izindlela zamakhemikhali ezifana ne-sulfuric acid ne-hydrogen peroxide.
3. Ama-ion ensimbi:
Ukungcola okujwayelekile kwensimbi kuhlanganisa insimbi, ithusi, i-aluminium, i-chromium, insimbi ekhonjiwe, i-titanium, i-sodium, i-potassium, i-lithium, njll. Imithombo eyinhloko yizitsha ezihlukahlukene, amapayipi, ama-reagents amakhemikhali, nokungcoliswa kwensimbi okukhiqizwa lapho ukuxhumeka kwensimbi kwakhiwa ngesikhathi sokucubungula.
Lolu hlobo lokungcola luvame ukususwa ngezindlela zamakhemikhali ngokwakhiwa kwe-metal ion complexes.
4. I-oxide:
Lapho i-semiconductorizinkwa eziwucwecwezivezwe endaweni equkethe umoya-mpilo namanzi, ungqimba lwe-oxide lwemvelo luzokwakheka phezulu. Le filimu ye-oxide izovimbela izinqubo eziningi ekwenziweni kwe-semiconductor futhi iqukethe nokungcola okuthile kwensimbi. Ngaphansi kwezimo ezithile, zizokwenza amaphutha kagesi.
Ukususwa kwale filimu ye-oxide kuvame ukuqedwa ngokucwiliswa emanzini e-dilute hydrofluoric acid.
Ukulandelana kokuhlanza okujwayelekile
Ukungcola okukhangisiwe ebusweni be-semiconductorizinkwa eziwucwecwezingahlukaniswa zibe izinhlobo ezintathu: amangqamuzana, ionic kanye athomu.
Phakathi kwazo, amandla e-adsorption phakathi kokungcola kwamangqamuzana nobuso be-wafer abuthakathaka, futhi lolu hlobo lwezinhlayiya zokungcola kulula ukukususa. Ikakhulukazi ukungcola okunamafutha okunezici ze-hydrophobic, okungahlinzeka ngokufihla ukungcola kwe-ionic ne-athomu okungcolisa ingaphezulu lama-wafers we-semiconductor, okungahambisani nokususwa kwalezi zinhlobo ezimbili zokungcola. Ngakho-ke, lapho ama-wafers we-semiconductor ehlanzwa ngamakhemikhali, ukungcola kwamangqamuzana kufanele kususwe kuqala.
Ngakho-ke, inqubo ejwayelekile ye-semiconductorisilucwecwanainqubo yokuhlanza ithi:
I-De-molecularization-deionization-de-atomization-deionized amanzi okugeza.
Ngaphezu kwalokho, ukuze kukhishwe ungqimba lwe-oxide yemvelo ebusweni be-wafer, isinyathelo sokucwiliswa se-amino acid esincibilikisiwe sidinga ukungezwa. Ngakho-ke, umqondo wokuhlanza owokuqala ukususa ukungcola okuphilayo ebusweni; bese uncibilikisa ungqimba lwe-oxide; ekugcineni susa izinhlayiya kanye nokungcoliswa kwensimbi, futhi udlulise ubuso ngesikhathi esifanayo.
Izindlela zokuhlanza ezivamile
Izindlela zamakhemikhali zivame ukusetshenziselwa ukuhlanza ama-wafers we-semiconductor.
Ukuhlanzwa ngamakhemikhali kubhekisela kwinqubo yokusebenzisa ama-reagents amakhemikhali ahlukahlukene kanye nezincibilikisi eziphilayo ukuze kusabele noma ukuncibilikisa ukungcola namabala kawoyela endaweni ewucwecwe ukuze kukhishwe ukungcola, bese kuhlanjululwa ngamanzi acwengekile aphezulu ashisayo nabandayo ukuze kutholwe. indawo ehlanzekile.
Ukuhlanza ngamakhemikhali kungahlukaniswa ngokuhlanza amakhemikhali amanzi kanye nokuhlanza kwamakhemikhali okomile, phakathi kwawo ukuhlanza amakhemikhali amanzi kusabusa.
Ukuhlanza amakhemikhali amanzi
1. Ukuhlanza amakhemikhali amanzi:
Ukuhlanza amakhemikhali amanzi ikakhulukazi kufaka phakathi ukucwiliswa kwesixazululo, ukukhuhla ngomshini, ukuhlanzwa nge-ultrasonic, ukuhlanzwa kwe-megasonic, ukufafaza ngokujikeleza, njll.
2. Ukucwiliswa kwesixazululo:
Ukucwiliswa kwesixazululo kuyindlela yokususa ukungcoliswa kwendawo ngokucwilisa iwafa esixazululweni samakhemikhali. Kuyindlela esetshenziswa kakhulu ekuhlanzeni amakhemikhali amanzi. Izixazululo ezihlukene zingasetshenziswa ukususa izinhlobo ezahlukene zokungcola ebusweni be-wafer.
Ngokuvamile, le ndlela ayikwazi ukususa ngokuphelele ukungcola okungaphezulu kwe-wafer, ngakho-ke izinyathelo ezingokwenyama ezifana nokushisa, i-ultrasound, nokushukumisa zivame ukusetshenziswa ngenkathi kucwiliswa.
3. Ukukhuhla ngomshini:
Ukukhuhla ngomshini kuvame ukusetshenziselwa ukususa izinhlayiya noma izinsalela ze-organic ebusweni be-wafer. Ngokuvamile ingahlukaniswa ngezindlela ezimbili:ukukhuhla ngesandla kanye nokukhuhla nge-wiper.
Ukukhuhla mathuphaindlela elula yokukhuhla. Ibhulashi lensimbi engagqwali lisetshenziselwa ukubamba ibhola elicwiliswe ku-ethanol engena-hydrous noma ezinye izincibilikisi eziphilayo futhi kuhlikihlwe ngobumnene ingaphezulu le-wafer liye ohlangothini olufanayo ukuze kukhishwe ifilimu ye-wax, uthuli, ingcina yeglue noma ezinye izinhlayiya eziqinile. Le ndlela kulula ukubangela imihuzuko kanye nokungcola okukhulu.
I-wiper isebenzisa ukuzungezisa kwemishini ukuze ihlikihle ingaphezulu lewafa ngebhulashi loboya elithambile noma ibhulashi elixubile. Le ndlela inciphisa kakhulu imihuzuko ku-wafer. I-high-pressure wiper ngeke iklwebhe i-wafer ngenxa yokushoda kwe-mechanical friction, futhi ingasusa ukungcola emseleni.
4. Ukuhlanza nge-ultrasonic:
Ukuhlanza kwe-Ultrasonic kuyindlela yokuhlanza esetshenziswa kabanzi embonini ye-semiconductor. Izinzuzo zayo ziwumphumela omuhle wokuhlanza, ukusebenza okulula, futhi kungahlanza amadivaysi ayinkimbinkimbi neziqukathi.
Le ndlela yokuhlanza ingaphansi kwesenzo samagagasi anamandla e-ultrasonic (imvamisa ye-ultrasonic evame ukusetshenziswa yi-20s40kHz), futhi izingxenye ezincane neziminyene zizokhiqizwa ngaphakathi kwe-liquid medium. Ingxenye encane izokhiqiza ibhamuza le-vacuum cavity. Lapho ibhamuza le-cavity linyamalala, kuzokwenziwa umfutho wasendaweni oqinile eduze kwalo, kwephule amabhondi amakhemikhali kuma-molecule ukuze kuncibilike ukungcola endaweni eyiwafa. Ukuhlanza nge-Ultrasonic kuphumelela kakhulu ekususeni izinsalela ze-flux ezingancibiliki noma ezingancibiliki.
5. Ukuhlanza i-Megasonic:
Ukuhlanza i-Megasonic akugcini nje kunezinzuzo zokuhlanza i-ultrasonic, kodwa futhi kunqoba ukushiyeka kwayo.
Ukuhlanza i-Megasonic kuyindlela yokuhlanza ama-wafers ngokuhlanganisa umphumela wokudlidliza wamandla aphezulu (850kHz) nokusabela kwamakhemikhali kwama-ejenti okuhlanza amakhemikhali. Ngesikhathi sokuhlanza, ama-athomu esixazululo asheshiswa yigagasi le-megasonic (isivinini esikhulu esisheshayo singafinyelela ku-30cmVs), futhi igagasi loketshezi olunesivinini esikhulu lilokhu lithinta ingaphezulu lesicwecwana, ukuze izinto ezingcolisayo nezinhlayiya ezinhle ezinamathele ebusweni be-wafer. i-wafer ikhishwa ngenkani bese ifaka isisombululo sokuhlanza. Ukwengeza ama-acidic surfactants esixazululweni sokuhlanza, ngakolunye uhlangothi, kungafeza inhloso yokukhipha izinhlayiya nezinto eziphilayo endaweni yokupholisha ngokusebenzisa i-adsorption yama-surfactants; ngakolunye uhlangothi, ngokuhlanganiswa kwama-surfactants kanye nemvelo ene-acidic, ingafinyelela inhloso yokususa ukungcola kwensimbi ebusweni beshidi lokupholisha. Le ndlela ingadlala ngesikhathi esisodwa indima yokusula ngomshini nokuhlanza amakhemikhali.
Njengamanje, indlela yokuhlanza i-megasonic isibe yindlela ephumelelayo yokuhlanza amashidi okupholisha.
6. Indlela yesifutho esijikelezayo:
I-Rotary spray method iyindlela esebenzisa izindlela zemishini ukuzungezisa iwafa ngesivinini esikhulu, futhi iqhubeke ifutha uketshezi (amanzi acwengekile aphezulu noma olunye uketshezi lokuhlanza) phezu kwewafa phakathi nenqubo yokuzungezisa ukuze kususwe ukungcola ubuso be-wafer.
Le ndlela isebenzisa ukungcoliswa okungaphezulu kwewafa ukuze incibilike oketshezini olufuthwe (noma isabela ngamakhemikhali ukuze incibilike), futhi isebenzisa umphumela omaphakathi wokuzungezisa ngesivinini esikhulu ukwenza uketshezi oluqukethe ukungcola luhlukane nobuso bewafa. ngesikhathi.
Indlela yesifutho se-rotary inezinzuzo zokuhlanza amakhemikhali, ukuhlanzwa kwemishini ewuketshezi, nokukhuhla ngomfutho ophezulu. Ngesikhathi esifanayo, le ndlela ingabuye ihlanganiswe nenqubo yokomisa. Ngemuva kwenkathi yokuhlanza isifutho samanzi e-deionized, isifutho samanzi siyamiswa bese kusetshenziswa igesi yokufutha. Ngesikhathi esifanayo, isivinini sokuzungeza singanyuswa ukuze kwandiswe amandla e-centrifugal ukususa amanzi ngokushesha ebusweni be-wafer.
7.Ukuhlanza amakhemikhali okomile
Ukuhlanza okomile kubhekisela kubuchwepheshe bokuhlanza obungasebenzisi izixazululo.
Ubuchwepheshe bokuhlanza okomile obusetshenziswa njengamanje buhlanganisa: ubuchwepheshe bokuhlanza i-plasma, ubuchwepheshe bokuhlanza isigaba segesi, ubuchwepheshe bokuhlanza i-beam, njll.
Izinzuzo zokuhlanza okomile ziyinqubo elula futhi akukho ukungcoliswa kwemvelo, kodwa izindleko ziphezulu futhi ububanzi bokusetshenziswa abukhulu okwamanje.
1. Ubuchwepheshe bokuhlanza i-Plasma:
Ukuhlanza i-plasma kuvame ukusetshenziswa kunqubo yokususa i-photoresist. Inani elincane lomoya-mpilo lingeniswa ohlelweni lokusabela kwe-plasma. Ngaphansi kwesenzo senkambu kagesi enamandla, umoya-mpilo ukhiqiza i-plasma, eyenza ngokushesha i-photoresist ibe yisimo segesi esishintshashintshayo futhi ikhishwe.
Lobu buchwepheshe bokuhlanza bunezinzuzo zokusebenza okulula, ukusebenza kahle okuphezulu, indawo ehlanzekile, akukho mihuzuko, futhi kusiza ekuqinisekiseni ikhwalithi yomkhiqizo enqubweni ye-degumming. Ngaphezu kwalokho, ayisebenzisi ama-acids, ama-alkali kanye nezincibilikisi eziphilayo, futhi azikho izinkinga ezifana nokulahlwa kwemfucuza kanye nokungcoliswa kwemvelo. Ngakho-ke, liya ngokuya liziswa abantu. Kodwa-ke, ayikwazi ukususa i-carbon nokunye ukungcola kwensimbi okungaguquki noma i-metal oxide.
2. Ubuchwepheshe bokuhlanza isigaba segesi:
Ukuhlanzwa kwesigaba segesi kubhekisela endleleni yokuhlanza esebenzisa isigaba segesi esilingana nento ehambisanayo enqubweni yoketshezi ukuze kuhlangatshezwane nento engcolile ebusweni bewafa ukuze kufezwe injongo yokukhipha ukungcola.
Isibonelo, kunqubo ye-CMOS, ukuhlanzwa kwewafa kusebenzisa ukusebenzisana phakathi kwesigaba segesi i-HF nomhwamuko wamanzi ukuze kukhishwe ama-oxide. Ngokuvamile, inqubo ye-HF equkethe amanzi kufanele ihambisane nenqubo yokususa izinhlayiyana, kuyilapho ukusetshenziswa kwe-gas phase HF yokuhlanza ubuchwepheshe akudingi inqubo yokususa izinhlayiya ezilandelayo.
Izinzuzo ezibaluleke kakhulu uma ziqhathaniswa nenqubo ye-HF enamanzi ukusetshenziswa kwamakhemikhali e-HF kuncane kakhulu kanye nokusebenza kahle kokuhlanza okuphezulu.
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Isikhathi sokuthumela: Aug-13-2024