Amathagethi we-sputtering asetshenziswa kumasekethe ahlanganisiwe we-semiconductor

Amathagethi we-Sputteringasetshenziswa kakhulu ezimbonini zama-elekthronikhi nolwazi, njengamasekhethi ahlanganisiwe, ukugcinwa kolwazi, izibonisi zekristalu eliwuketshezi, izinkumbulo ze-laser, izisetshenziswa zokulawula zika-elekthronikhi, njll. Angasetshenziswa futhi emkhakheni wokumboza ingilazi, kanye nasekungagugeki. izinto zokwakha, izinga lokushisa eliphezulu ukumelana nokugqwala, imikhiqizo yokuhlobisa ephezulu kanye nezinye izimboni.

Ukuhlanzeka Okuphezulu 99.995% Ithagethi ye-Titanium SputteringIthagethi ye-Ferrum SputteringIthagethi yeCarbon C Sputtering, Target Graphite

I-Sputtering ingenye yezindlela eziyinhloko zokulungiselela izinto zefilimu ezincane.Isebenzisa ama-ion akhiqizwa imithombo ye-ion ukusheshisa nokuhlanganisa endaweni engenalutho ukuze kwakheke imishayo ye-ion yamandla enesivinini esiphezulu, ibhomu indawo eqinile, futhi ishintshisane amandla e-kinetic phakathi kwama-ion nama-athomu angaphezulu aqinile. Ama-athomu asendaweni eqinile ashiya okuqinile futhi abekwe phezu kwe-substrate. Okuqinile okuqhunyiswa ngamabhomu kuyizinto ezingavuthiwe zokufaka amafilimu amancanyana ngokufafaza, okubizwa ngokuthi i-sputtering target. Izinhlobo ezahlukahlukene zezinto zefilimu ezacile eziphahliwe zisetshenziswe kabanzi kumasekethe ahlanganisiwe we-semiconductor, imidiya yokuqopha, imibukiso yephaneli eliyisicaba kanye nezingubo zokusebenzela.

Phakathi kwazo zonke izimboni zohlelo lokusebenza, imboni ye-semiconductor inezidingo zekhwalithi eziqine kakhulu zamafilimu ahlosiwe ahlambalazayo.Izinjongo zokuphalaza zensimbi ezihlanzekile zisetshenziswa kakhulu ekukhiqizeni ama-wafer kanye nezinqubo zokupakisha ezithuthukisiwe. Uma sithatha ukukhiqizwa kwama-chip njengesibonelo, singabona ukuthi kusukela ku-silicon wafer kuya ku-chip, idinga ukudlula izinqubo zokukhiqiza ezingu-7 ezinkulu, okuyi-diffusion (Thermal Process), Photo-lithography (Photo-lithography), Etch (Etch), I-Ion Implantation (IonImplant), I-Thin Film Growth (Dielectric Deposition), Chemical Mechanical Polishing (CMP), Metalization (Metalization) Izinqubo zihambisana ngayinye ngayinye. Ithagethi ye-sputtering isetshenziswa ohlelweni "lwe-metallization". Okuqondiwe kuhlaselwe izinhlayiya ezinamandla kakhulu ngezinto zokufakwa kwefilimu ezacile bese kwakheka ungqimba lwensimbi olunemisebenzi ethile kusiluli se-silicon, esifana nosendlalelo esibambayo, ungqimba lokuvimbela. Linda.Njengoba izinqubo zawo wonke ama-semiconductors ziyahlukahluka ngakho-ke ezinye izimo zezikhathi ezithile ziyadingeka ukuze kuqinisekiswe ukuthi isistimu ikhona ngendlela efanele ngakho-ke sifuna izinhlobo ezithile zezinto eziyizidumi ezigabeni ezithile zokukhiqiza ukuze siqinisekise imiphumela.


Isikhathi sokuthumela: Jan-17-2022
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