Kwihlabathi elintsonkothileyo letekhnoloji yanamhlanje,amaqebengwana, ekwabizwa ngokuba zii-silicon wafers, zezona zinto ziphambili kushishino lwesemiconductor. Zisisiseko sokwenza amacandelo ahlukeneyo e-elektroniki anje nge-microprocessors, inkumbulo, izinzwa, njl. Ke kutheni sihlala sibona ama-wafers angama-25 ebhokisini? Kukho ngokwenene ukuqwalaselwa kwenzululwazi kunye noqoqosho lwemveliso yezoshishino emva koku.
Ukutyhila isizathu sokuba kukho ii-wafers ezingama-25 ebhokisini
Okokuqala, qonda ubungakanani be-wafer. Ubungakanani obuqhelekileyo be-wafer buqhele ukuba yi-intshi ezili-12 kunye ne-intshi ezili-15, eziziqhelanisa nezixhobo ezahlukeneyo zokuvelisa kunye neenkqubo.Ii-intshi ezili-12 zamawafaokwangoku zezona ntlobo zixhaphakileyo kuba zinokuthatha iitshiphusi ezininzi kwaye zilungelelaniswe ngokwentelekiso kwiindleko zokwenziwa kunye nokusebenza kakuhle.
Inani "amaqhekeza angama-25" alikho ngengozi. Isekelwe kwindlela yokusika kunye nokusebenza kakuhle kokupakishwa kwe-wafer. Emva kokuba i-wafer nganye ivelisiwe, kufuneka isikwe ukwenza iichips ezininzi ezizimeleyo. Ngokuqhelekileyo, aI-12-intshi ye-waferinokusika amakhulu okanye amawaka etshiphusi. Nangona kunjalo, ukuze kube lula ukulawula kunye nokuthutha, ezi chips zihlala zipakishwa ngobuninzi obuthile, kwaye iziqwenga ezingama-25 lukhetho oluqhelekileyo lobuninzi kuba alukhulu kakhulu kwaye alukhulu kakhulu, kwaye lunokuqinisekisa uzinzo olwaneleyo ngexesha lokuhamba.
Ukongeza, ubungakanani beziqwenga ezingama-25 zikwanceda ukuzenzela kunye nokulungelelaniswa komgca wemveliso. Ukuveliswa kwebhetshi kunokunciphisa iindleko zokusetyenzwa kweqhekeza elinye kunye nokuphucula ukusebenza kakuhle kwemveliso. Ngexesha elifanayo, ukugcinwa kunye nokuthutha, ibhokisi ye-wafer ye-25-piece kulula ukuyisebenzisa kwaye inciphisa umngcipheko wokuphuka.
Kuyafaneleka ukuba uqaphele ukuba ukuqhubela phambili kweteknoloji, ezinye iimveliso eziphezulu zingamkela inani elikhulu leephakheji, ezifana ne-100 okanye i-200 yamaqhekeza, ukuqhubela phambili ukuphucula ukusebenza kwemveliso. Nangona kunjalo, kwiimveliso ezininzi zomgangatho wabathengi kunye nomgangatho ophakathi, ibhokisi ye-wafer ye-25-piece isengummiselo oqhelekileyo oqhelekileyo.
Isishwankathelo, ibhokisi yee-wafers ihlala iqulethe iziqwenga ezingama-25, eyibhalansi efunyenwe yishishini le-semiconductor phakathi kokusebenza kakuhle kwemveliso, ukulawulwa kweendleko kunye nokusebenziseka lula. Ngophuhliso oluqhubekayo lwetekhnoloji, eli nani linokulungiswa, kodwa ingqiqo esisiseko emva kwayo - ukulungelelanisa iinkqubo zemveliso kunye nokuphucula izibonelelo zoqoqosho - zihlala zingatshintshi.
I-12-inch wafer fabs zisebenzisa iFOUP kunye neFOSB, kunye ne-8-intshi nangaphantsi (kubandakanya i-8-intshi) sebenzisa iCassette, SMIF POD, kunye nebhokisi yesikhephe esisicaba, oko kukuthi, i-12-intshiumthwali we-waferngokudibeneyo ibizwa ngokuba yiFOUP, kunye ne-8-intshiumthwali we-waferngokudibeneyo ibizwa ngokuba yiCassette. Ngokuqhelekileyo, i-FOUP engenanto inobunzima obumalunga ne-4.2 kg, kunye ne-FOUP ezaliswe ngama-wafers angama-25 inobunzima be-7.3 kg.
Ngokophando kunye namanani eqela lophando lwe-QYResearch, intengiso yeebhokisi ze-wafer yehlabathi ifikelele kwi-4.8 yeebhiliyoni zeeyuan ngo-2022, kwaye kulindeleke ukuba ifikelele kwi-7.7 yeebhiliyoni zeeyuan ngo-2029, ngesantya sokukhula ngonyaka (CAGR) se-7.9%. Ngokohlobo lwemveliso, i-semiconductor FOUP ithatha esona sabelo sikhulu kwimarike yonke, malunga ne-73%. Ngokubhekiselele kwisicelo semveliso, isicelo esikhulu kunazo zonke zii-wafers ze-intshi ezili-12, zilandelwa ngamaqhekeza angama-8-intshi.
Enyanisweni, kukho iintlobo ezininzi zokuthwala i-wafer, njenge-FOUP yokudluliselwa kwe-wafer kwizityalo zokwenza i-wafer; I-FOSB yokuthutha phakathi kwemveliso ye-silicon wafer kunye nezityalo zokwenza i-wafer; Abathwali be-CASSETTE bangasetyenziselwa ukuthuthwa kwenkqubo phakathi kunye nokusetyenziswa ngokubambisana neenkqubo.
VULA IKHASETHI
OPEN CASSETTE isetyenziswa ikakhulu kwi-inter-process transportation kunye neenkqubo zokucoca kwi-wafer production. Njenge-FOSB, i-FOUP kunye nabanye abathwali, ngokuqhelekileyo isebenzisa izinto ezikwaziyo ukumelana nobushushu, zineempawu ezibalaseleyo zoomatshini, ukuzinza kwe-dimensional, kwaye zomelele, zi-anti-static, i-low out-gassing, imvula ephantsi, kunye ne-recyclable. Iisayizi ezahlukeneyo zewafer, iindawo zenkqubo, kunye nezixhobo ezikhethelwe iinkqubo ezahlukeneyo zahlukile. Izinto eziqhelekileyo ziyi-PFA, PTFE, PP, PEEK, PES, PC, PBT, PEI, COP, njl njl.
VULA I-CASSETTE inokusetyenziswa ngokuhambelanayoIkhasethi yeWaferiimveliso zokugcinwa kwe-wafer kunye nokuthutha phakathi kweenkqubo zokunciphisa ukungcoliseka kwe-wafer.
IVULA I-CASSETTE isetyenziswe ngokubambisana neemveliso ze-Wafer Pod (OHT), ezingasetyenziselwa ukuhanjiswa ngokuzenzekelayo, ukufikelela ngokuzenzekelayo kunye nokugcinwa okutywinwe ngakumbi phakathi kweenkqubo zokwenziwa kwe-wafer kunye nokuveliswa kwe-chip.
Ngokuqinisekileyo, OPEN CASSETTE inokwenziwa ngokuthe ngqo kwiimveliso zeCASSETTE. Imveliso yeeBhokisi zokuThumela iWafer inesakhiwo esinjalo, njengoko kubonisiwe kulo mfanekiso ungezantsi. Inokuhlangabezana neemfuno zothutho lwewafer ukusuka kwizityalo zokwenza iwafer ukuya kwizityalo zokwenza iitshiphu. I-CASSETTE kunye nezinye iimveliso ezivela kuyo zinokuhlangabezana neemfuno zothumelo, ukugcinwa kunye nokuthutha phakathi kweefektri phakathi kweenkqubo ezahlukeneyo kwiifektri ze-wafer kunye neefektri ze-chip.
Ibhokisi yokuThumela ePhambili yokuVula i-Wafer FOSB
Ibhokisi yokuThumela yaPhambi yokuVula i-FOSB isetyenziselwa ikakhulu ukuthutha ii-intshi ezili-12 zamawafa phakathi kwemizi-mveliso yokwenziwa kwe-wafer kunye nezityalo zokwenza iitshiphu. Ngenxa yobukhulu obukhulu bama-wafers kunye neemfuno eziphezulu zokucoceka; iziqwenga zokubeka ezikhethekileyo kunye noyilo lwe-shockproof zisetyenziselwa ukunciphisa ukungcola okuveliswa yi-wafer displacement friction; izinto ekrwada zenziwe ngezinto ezisezantsi-outgassing, ezinokuthi ukunciphisa umngcipheko ngaphandle-gassing ezingcolisekileyo wafers. Xa kuthelekiswa nezinye iibhokisi ze-wafer zothutho, i-FOSB inokuqina komoya okungcono. Ukongeza, kumzi-mveliso womgca wokupakisha ngasemva, iFOSB inokusetyenziselwa ukugcinwa kunye nokudluliselwa kweewafers phakathi kweenkqubo ezahlukeneyo.
I-FOSB yenziwe ngokubanzi ibe ngamaqhekeza angama-25. Ukongeza kokugcinwa ngokuzenzekelayo kunye nokubuyiswa ngeNkqubo yokuSebenza ngokuSebenzayo (AMHS), inokuphinda iqhutywe ngesandla.
Ukuvula Ngaphambili IPod eManyeneyo
I-Front Opening Pod edibeneyo (FOUP) isetyenziselwa ukhuseleko, ukuthutha kunye nokugcinwa kwee-wafers kwi-Fab factory. Sisikhongozeli esibalulekileyo esithwalayo senkqubo yokuhambisa iautomated kwi-12-intshi ye-wafer factory. Umsebenzi wayo obaluleke kakhulu kukuqinisekisa ukuba zonke ii-wafers ezingama-25 zikhuselwe yiyo ukuphepha ukungcoliswa luthuli kwindawo yangaphandle ngexesha lokuhanjiswa phakathi komatshini ngamnye wokuvelisa, ngaloo ndlela kuchaphazela isivuno. I-FOUP nganye ineepleyiti zokudibanisa ezahlukeneyo, izikhonkwane kunye nemingxuma ukwenzela ukuba i-FOUP ibekwe kwi-port yokulayisha kwaye iqhutywe yi-AMHS. Isebenzisa izinto eziphantsi zokukhupha i-gassing kunye nezinto eziphantsi zokufunxa ukufuma, ezinokunciphisa kakhulu ukukhutshwa kwezinto eziphilayo kunye nokuthintela ukungcoliseka kwe-wafer; kwangaxeshanye, ukutywinwa okugqwesileyo kunye nomsebenzi wokunyuka kwamaxabiso kunokubonelela ngemekobume yokufuma ephantsi kwiwafer. Ukongeza, i-FOUP inokuyilwa ngemibala eyahlukeneyo, efana nebomvu, i-orenji, emnyama, ecacileyo, njl. njl., ukuhlangabezana neemfuno zenkqubo kunye nokwahlula iinkqubo ezahlukeneyo kunye neenkqubo; ngokubanzi, i-FOUP ilungiselelwe ngabathengi ngokuhambelana nomgca wemveliso kunye nokwahlukana koomatshini beFab factory.
Ukongeza, iPOUP inokwenziwa ngokweemveliso ezikhethekileyo kubenzi bokupakisha ngokweenkqubo ezahlukeneyo ezifana ne-TSV kunye ne-FAN OUT kwi-chip back-end packaging, efana ne-SLOT FOUP, 297mm FOUP, njl. njl. IFOUP inokuphinda isetyenziswe, kwaye ubomi bayo phakathi kwe-2-4 iminyaka. Abavelisi be-FOUP banokubonelela ngeenkonzo zokucoca imveliso ukuhlangabezana neemveliso ezingcolisekileyo ukuze zisetyenziswe kwakhona.
Uqhagamshelwano oluthe tyaba lweWafer
Iinqanawa zokuqhagamshelwa eziHorizontal ezixwesileyo zisetyenziselwa ukuthutha amaqhekeza agqityiweyo, njengoko kubonisiwe kulo mfanekiso ungezantsi. Ibhokisi yezothutho ye-Entegris isebenzisa indandatho yokuxhasa ukuqinisekisa ukuba ama-wafers awadibanisi ngexesha lokugcinwa kunye nokuthutha, kwaye atywinwe kakuhle ukuthintela ukungcoliseka kokungcola, ukunxiba, ukungqubana, imikrwelo, i-degassing, njl. ii-wafers eziqhumayo, kunye neendawo zayo zokusebenza ziquka i-3D, i-2.5D, i-MEMS, i-LED kunye ne-semiconductors yamandla. Imveliso ixhotyiswe ngamakhonkco enkxaso angama-26, kunye nomthamo we-wafer we-25 (enobunzima obahlukeneyo), kunye nobukhulu be-wafer bubandakanya i-150mm, i-200mm kunye ne-300mm.
Ixesha lokuposa: Jul-30-2024