Yintoni indlela yokucwangcisa yeCMP?

I-Dual-Damascene yitekhnoloji yenkqubo esetyenziselwa ukuvelisa i-metal interconnects kwiisekethe ezidibeneyo. Luphuhliso olongezelelweyo lwenkqubo yeDamasko. Ngokwenza ngokusebenzisa imingxuma kunye ne-grooves ngexesha elifanayo kwisinyathelo senkqubo efanayo kunye nokuzalisa ngesinyithi, ukuveliswa okudibeneyo kokudibanisa isinyithi kuyenzeka.

Kutheni kusithiwa yiDamasko?

Isixeko saseDamasko likomkhulu laseSiriya, yaye amakrele eDamasko adume ngobubukhali bawo nokuhomba kwawo. Kufunwa uhlobo lwenkqubo yokufakela: okokuqala, iphethini efunekayo ikrolwe phezu kobuso bensimbi yaseDamasko, kwaye izinto ezilungiselelwe kwangaphambili zifakwe ngokuqinileyo kwiigrooves ezikroliweyo. Emva kokuba i-inlay igqityiwe, umphezulu unokuthi ungalingani. Ingcibi iya kuyipholisa ngononophelo ukuze iqinisekise ukuguda okupheleleyo. Kwaye le nkqubo ngumzekelo wenkqubo yeDamasko ephindwe kabini yechip. Okokuqala, i-grooves okanye imingxuma ibhalwe kwi-dielectric layer, kwaye isinyithi sizaliswe kuzo. Emva kokuzaliswa, isinyithi esingaphezulu siya kususwa nge-cmp.

Amanyathelo aphambili enkqubo yedamascene ezimbini abandakanya:

▪ Ukubekwa kwe-dielectric layer:

Idiphozithi umaleko wemathiriyeli yedielectric, efana nesilicon dioxide (SiO2), kwisemiconductoriqhekeza lesonka.

▪ Ifotolithography ukuchaza ipateni:

Sebenzisa i-photolithography ukuchaza ipateni ye-vias kunye nemisele kwi-dielectric layer.

▪Etching:

Dlulisa ipateni ye-vias kunye nemisele kwi-dielectric layer ngokusebenzisa inkqubo eyomileyo okanye emanzi.

▪ Ukubekwa kwentsimbi:

Idiphozithi yesinyithi, njengobhedu (Cu) okanye i-aluminium (Al), kwi-vias kunye nemisele ukwenza imidibaniso yesinyithi.

▪ Ukuguliswa koomatshini ngemichiza:

I-Chemical mechanical polishing ye-metal surface ukususa isinyithi engaphezulu kunye nokunciphisa umphezulu.

Xa kuthelekiswa nenkqubo yokwenziwa koqhagamshelo lwentsimbi yesiko, inkqubo yedamascene kabini inezi nzuzo zilandelayo:

▪Amanyathelo enkqubo eyenziwe lula:ngokwenza i-vias kunye nemisele ngaxeshanye kwinyathelo lenkqubo efanayo, amanyathelo enkqubo kunye nexesha lokuvelisa liyancitshiswa.

▪ Uphuculo lokwenziwa kwemveliso:ngenxa yokunciphisa amanyathelo enkqubo, inkqubo yedamascene emibini inokuphucula ukusebenza kakuhle kokuvelisa kunye nokunciphisa iindleko zokuvelisa.

▪Ukuphucula ukusebenza koqhagamshelo lwentsimbi:inkqubo yedamascene emibini inokufezekisa ukudibanisa kwentsimbi encinci, ngaloo ndlela iphucula ukudibanisa kunye nokusebenza kweesekethe.

▪ Ukunciphisa amandla eparasitic kunye nokuxhathisa:ngokusebenzisa izixhobo ze-dielectric eziphantsi-k kunye nokuphucula ubume be-metal interconnects, i-parasitic capacitance kunye nokumelana kungancitshiswa, ukuphucula isantya kunye nokusebenza kokusetyenziswa kwamandla kweesekethe.