Waferukusika lelinye lamakhonkco abalulekileyo kwimveliso ye-semiconductor yamandla. Eli nyathelo lenzelwe ukwahlula ngokuchanekileyo iisekethe ezidityanisiweyo zomntu ngamnye okanye iitshiphusi ezivela kwi-semiconductor wafers.
Isitshixo sokuiqhekeza lesonkaukusika kukukwazi ukwahlula iitshiphusi zomntu ngamnye ngelixa uqinisekisa ukuba izakhiwo ezibuthathaka kunye neesekethe ezifakwe ngaphakathi.iqhekeza lesonkaayonakaliswa. Ukuphumelela okanye ukungaphumeleli kwenkqubo yokusika akuchaphazeli kuphela umgangatho wokwahlula kunye nesivuno se-chip, kodwa ihambelana ngokuthe ngqo nokusebenza kwayo yonke inkqubo yokuvelisa.
▲ Iintlobo ezintathu eziqhelekileyo zokusikwa kwe-wafer | Umthombo: KLA CHINA
Okwangoku, eqhelekileyoiqhekeza lesonkaiinkqubo zokusika zahlulwe zibe:
Ukusika iblade: ixabiso eliphantsi, elidla ngokusetyenziselwa ukutyebaamaqebengwana
Ukusika kweLaser: ixabiso eliphezulu, elidla ngokusetyenziswa kwiiwafers ezinobunzima obungaphezulu kwe-30μm
Ukusika i-Plasma: ixabiso eliphezulu, izithintelo ezingaphezulu, zihlala zisetyenziselwa ama-wafers anobunzima obungaphantsi kwe-30μm
Ukusika i-Mechanical blade
Ukusika i-blade yinkqubo yokusika ecaleni komgca wokubhala nge-disk ejikelezayo ejikelezayo yokugaya (i-blade). I-blade ngokuqhelekileyo yenziwe nge-abrasive okanye i-ultra-thin diamond material, ilungele ukunqunyulwa okanye i-grooving kwii-wafers ze-silicon. Nangona kunjalo, njengendlela yokusika ngomatshini, ukusika i-blade kuxhomekeke ekususweni kwezinto ezibonakalayo, ezinokuthi zikhokelela ngokulula ekuqhekekeni okanye ekuqhekekeni kwe-chip edge, ngaloo ndlela kuchaphazela umgangatho wemveliso kunye nokunciphisa isivuno.
Umgangatho wemveliso yokugqibela eveliswa yinkqubo yokubona ngomatshini ichaphazeleka kwiiparamitha ezininzi, kubandakanywa isantya sokusika, ubukhulu be-blade, ububanzi be-blade, kunye nesantya sokujikeleza kwe-blade.
Ukunqunyulwa okupheleleyo kuyona ndlela isisiseko sokusika i-blade, enqumla ngokupheleleyo i-workpiece ngokusika kwizinto ezisisigxina (njenge-tape ye-slicing).
▲ Iblade yomatshini yokusika-isika | Umthombo womfanekiso womnatha
Ukusikwa kwesiqingatha yindlela yokucubungula eyenza i-groove ngokusika phakathi kwendawo yokusebenza. Ngokuqhuba ngokuqhubekayo inkqubo ye-grooving, i-comb kunye neendawo ezimile njengenaliti zinokuveliswa.
▲ Iblade yomatshini yokusika isiqingatha | Umthombo womfanekiso womnatha
Ukusika kabini yindlela yokucubungula esebenzisa isarha yokusika kabini enezikhonkwane zokusonta ezimbini ukwenza ukusika okupheleleyo okanye okusisiqingatha kwimigca emibini yemveliso ngaxeshanye. Isarha yokusika kabini ineezembe ezimbini zokusonta. Ukusebenza okuphezulu kunokufezekiswa ngale nkqubo.
▲ Iblade yomatshini ukusika-kabini ukusika | Umthombo womfanekiso womnatha
Inyathelo lokusika lisebenzisa isarha yokusika kabini enezikhonkwane ezibini zokusonta ukwenza ukusika okupheleleyo kunye nesiqingatha kwizigaba ezibini. Sebenzisa iiblade ezilungiselelwe ukusika umaleko we-wiring kumphezulu we-wafer kunye neeblade ezilungiselelwe i-silicon enye yekristale eseleyo ukufezekisa ukusetyenzwa komgangatho ophezulu.
▲ Ukusika iblade ngoomatshini – ukusika inyathelo | Umthombo womfanekiso womnatha
Ukusika i-Bevel yindlela yokucubungula esebenzisa i-blade ene-V-shaped edge kwi-half-cut edge ukusika i-wafer kwizigaba ezibini ngexesha lokusika inyathelo. Inkqubo ye-chamfering yenziwa ngexesha lokusika. Ke ngoko, ukomelela okuphezulu kokungunda kunye nokusetyenzwa komgangatho ophezulu kunokufezekiswa.
▲ Ukusika iblade ngoomatshini – ukusika i-bevel | Umthombo womfanekiso womnatha
Ukusika kweLaser
Ukusika i-Laser yitekhnoloji yokusika i-wafer engadibananga esebenzisa umqadi we-laser ogxininisiweyo ukwahlula iitshiphusi zomntu ngamnye kwi-semiconductor wafers. I-laser beam ephezulu yamandla igxininise kumphezulu we-wafer kwaye ikhuphe okanye isuse izinto eziphathekayo kunye nomgca wokunqunyulwa kwangaphambili ngokukhupha okanye iinkqubo zokubola kwe-thermal.
▲ Umzobo wokusika iLaser | Umthombo womfanekiso: KLA CHINA
Iindidi zeelaser ezisetyenziswa ngokubanzi ngoku ziquka iilaser zeultraviolet, iilaser ze-infrared, kunye neefemtosecond lasers. Phakathi kwazo, iilaser ze-ultraviolet zihlala zisetyenziselwa ukukhutshwa okubandayo okuchanekileyo ngenxa yamandla aphezulu efoton, kwaye indawo echatshazelwe bubushushu incinci kakhulu, enokunciphisa ngokufanelekileyo umngcipheko womonakalo oshushu kwi-wafer kunye neechips ezijikelezileyo. Iilaser ze-infrared zilungele ngcono iiwafers ezityebileyo kuba zinokungena nzulu kwizinto eziphathekayo. Iilaser ze-Femtosecond zifezekisa ukuchaneka okuphezulu kunye nokususwa kwezinto ezisebenzayo kunye nokuhanjiswa kobushushu obungakhathaliyo ngokusebenzisa i-ultrashort light pulses.
Ukusika iLaser kuneengenelo ezibalulekileyo ngaphezu kokusika incakuba yemveli. Okokuqala, njengenkqubo engabandakanyiyo, ukusika kwe-laser akufuni ukunyanzeliswa komzimba kwi-wafer, ukunciphisa ukuhlukana kunye neengxaki eziqhekezayo eziqhelekileyo ekusikeni koomatshini. Eli nqaku lenza ukusika i-laser ifaneleke ngokukodwa ukusetyenzwa kwee-wafers ezibuthathaka okanye ezibhityileyo, ngakumbi ezo zinezakhiwo ezintsonkothileyo okanye iimpawu ezintle.
▲ Umzobo wokusika iLaser | Umthombo womfanekiso womnatha
Ukongeza, ukuchaneka okuphezulu kunye nokuchaneka kokusikwa kwelaser kuyenza ikwazi ukujolisa umqadi welaser kubungakanani bendawo encinci kakhulu, ukuxhasa iipateni zokusika ezintsonkothileyo, kunye nokufezekisa ukwahlulwa kwesithuba esincinci phakathi kweetshiphusi. Eli nqaku libaluleke kakhulu kwizixhobo eziphambili ze-semiconductor ezinobungakanani obunciphayo.
Nangona kunjalo, ukusika kwe-laser nako kunemida ethile. Xa kuthelekiswa nokusika i-blade, iyacotha kwaye ibiza kakhulu, ngakumbi kwimveliso enkulu. Ukongeza, ukukhetha uhlobo oluchanekileyo lwelaser kunye nokwandisa iiparamitha zokuqinisekisa ukususwa kwezinto ezifanelekileyo kunye nendawo encinci echatshazelwe bubushushu kunokuba ngumngeni kwizinto ezithile kunye nobukhulu.
Ukusikwa kweLaser ablation
Ngexesha lokusikwa kwe-laser ablation, umqadi we-laser ugxile ngokuchanekileyo kwindawo echaziweyo kumphezulu we-wafer, kwaye amandla e-laser akhokelwa ngokwepatheni yokusika esele imisiwe, ngokuthe chu ukusika kwi-wafer ukuya ezantsi. Ngokuxhomekeke kwiimfuno zokusika, lo msebenzi wenziwa ngokusebenzisa i-laser pulsed okanye i-laser wave eqhubekayo. Ukuze kuthintelwe umonakalo kwi-wafer ngenxa yokufudumeza okugqithisileyo kwendawo ye-laser, amanzi okupholisa asetyenziselwa ukupholisa kunye nokukhusela i-wafer kumonakalo we-thermal. Ngexesha elifanayo, amanzi okupholisa angakwazi ukususa ngokufanelekileyo iinqununu ezenziwe ngexesha lokusika, ukukhusela ukungcola kunye nokuqinisekisa umgangatho wokusika.
Ukusika okungabonakaliyo kweLaser
I-laser inokujolisa kwakhona ukuhambisa ubushushu kumzimba oyintloko we-wafer, indlela ebizwa ngokuba yi "invisible laser cutting". Kule ndlela, ukushisa okuvela kwi-laser kudala izikhewu kwiindlela zababhali. Ezi ndawo zibuthathaka zifikelela kwisiphumo esifanayo sokungena ngokuqhekeza xa i-wafer isoluliwe.
▲ Inkqubo ephambili yokusika okungabonakaliyo kwe-laser
Inkqubo yokusika engabonakaliyo yinkqubo ye-laser ye-absorption yangaphakathi, kunokuba i-laser ablation apho i-laser ifakwe phezu komhlaba. Ngokusikwa okungabonakaliyo, amandla e-laser beam ene-wavelength ene-semi-transparent kwi-wafer substrate material iyasetyenziswa. Inkqubo yahlulwe ngamanyathelo amabini aphambili, enye yinkqubo esekwe kwi-laser, kwaye enye yinkqubo yokwahlula ngoomatshini.
▲ Umqadi welaser wenza umbhobho ongaphantsi komphezulu wewafer, kwaye amacala angaphambili nangasemva awachaphazeleki | Umthombo womfanekiso womnatha
Kwinqanaba lokuqala, njengoko i-laser beam ihlola i-wafer, i-laser beam igxile kwindawo ethile ngaphakathi kwe-wafer, yenza indawo yokuqhekeka ngaphakathi. Amandla e-beam abangela uthotho lweentanda ukuba zenze ngaphakathi, ezingekanwebeki kubo bonke ubunzima be-wafer ukuya phezulu nangaphantsi.
▲Ukuthelekiswa kwe-100μm ii-wafers ze-silicon ezisikwe ngendlela ye-blade kunye nendlela yokusika engabonakaliyo ye-laser | Umthombo womfanekiso womnatha
Kwinqanaba lesibini, i-chip tape emazantsi e-wafer yandiswa ngokwasemzimbeni, nto leyo ebangela uxinzelelo lwe-tensile kwiintanda ngaphakathi kwe-wafer, enyanzelwa kwinkqubo yelaser kwinyathelo lokuqala. Olu xinzelelo lubangela ukuba iintanda zande ngokuthe nkqo kwindawo ephezulu kunye nesezantsi yewafa, kwaye emva koko yahlule i-wafer ibe ziichips ecaleni kwezi ndawo zokusika. Ekusikeni okungabonakaliyo, ukunqunyulwa kwesiqingatha okanye i-bottom-side-side-cut cut ngokuqhelekileyo kusetyenziselwa ukuququzelela ukuhlukana kwee-wafers zibe yi-chips okanye i-chips.
Iingenelo eziphambili zokusika i-laser engabonakaliyo ngaphezulu kokukhutshwa kwelaser:
• Akukho sipholisi sifunekayo
• Akukho nkunkuma yenziweyo
• Akukho mimandla ichaphazeleke bubushushu inokonakalisa iisekethe ezibuthathaka
Ukusika iplasma
Ukusika i-Plasma (ekwabizwa ngokuba yi-plasma etching okanye i-etching eyomileyo) yitekhnoloji yokusika i-wafer ehamba phambili esebenzisa i-ion etching esebenzayo (RIE) okanye i-ion etching esebenzayo (DRIE) ukwahlula iitshiphusi zomntu ngamnye kwi-semiconductor wafers. Itekhnoloji ifezekisa ukusika ngokususa izinto ngokwekhemikhali kunye nemigca yokusika esele imiselwe kusetyenziswa iplasma.
Ngethuba lenkqubo yokusika i-plasma, i-wafer ye-semiconductor ifakwe kwigumbi lokucoca, umxube olawulwayo wegesi osebenzayo ungeniswa kwigumbi, kwaye intsimi yombane isetyenziselwa ukuvelisa i-plasma equlethe i-concentration ephezulu ye-ion esebenzayo kunye ne-radicals. Ezi ntlobo ze-reactive zisebenzisana ne-wafer material kwaye ngokukhetha zisuse imathiriyeli ye-wafer ecaleni komgca we-scribe ngokusebenzisa indibanisela yokusabela kweekhemikhali kunye nokutshiza komzimba.
Inzuzo ephambili yokusika i-plasma kukuba iyanciphisa uxinzelelo lomatshini kwi-wafer kunye ne-chip kunye nokunciphisa umonakalo onokuthi ubangelwe kukuthintana ngokomzimba. Nangona kunjalo, le nkqubo inzima kakhulu kwaye ichitha ixesha kunezinye iindlela, ngakumbi xa ujongana nama-wafers atyebileyo okanye izinto ezinokumelana nokuqina okuphezulu, ngoko ke ukusetyenziswa kwayo kwimveliso yobuninzi kulinganiselwe.
▲Inethiwekhi yomthombo womfanekiso
Kwimveliso ye-semiconductor, indlela yokusika i-wafer kufuneka ikhethwe ngokusekelwe kwizinto ezininzi, kubandakanywa iipropati ze-wafer, ubukhulu be-chip kunye nejometri, ukuchaneka okufunekayo kunye nokuchaneka, kunye neendleko zemveliso kunye nokusebenza kakuhle.
Ixesha lokuposa: Sep-20-2024