Sputtering iithagethizisetyenziswa ikakhulu kumashishini ombane kunye nolwazi, anje ngeesekethe ezidityanisiweyo, ukugcinwa kolwazi, iziboniso zekristale elulwelo, iinkumbulo zelaser, izixhobo zokulawula i-elektroniki, njl. njl. izinto eziphathekayo, ubushushu obuphezulu bokumelana nokubola, iimveliso zokuhombisa eziphezulu kunye namanye amashishini.
I-Sputtering yenye yeendlela eziphambili zokulungiselela izixhobo zefilimu ezincinci.Isebenzisa iiyoni eziveliswa yimithombo ye-ion ukukhawulezisa kunye nokuhlanganisana kwindawo yokufunxa ukwenza imiqadi ye-ion yamandla esantya esiphezulu, ibhombu indawo eqinileyo, kunye notshintshiselwano lwamandla ekinetic phakathi kwee-ion kunye nee-athomu zomhlaba eziqinileyo. Iiathom ezikumphezulu oqinileyo zishiya okuqinileyo kwaye zifakwe kumphezulu we-substrate. Ibhombu eqinileyo yimathiriyeli ekrwada yokufaka iifilimu ezibhityileyo ngokutshiza, okubizwa ngokuba yithagethi ye-sputtering. Iindidi ezahlukahlukeneyo zemathiriyeli yefilimu ecekethekileyo esetyenzisiweyo isetyenziswe ngokubanzi kwiisekethe ezidityanisiweyo ze-semiconductor, imidiya yokurekhoda, imiboniso yephaneli ecaba kunye nokwaleka komphezulu womsebenzi.
Phakathi kwawo onke amashishini ezicelo, ishishini le-semiconductor lineemfuno ezingqongqo zomgangatho weefilimu ezijoliswe ku-sputtering.Iithagethi ze-high-purity metal sputtering zisetyenziswa kakhulu kwimveliso ye-wafer kunye neenkqubo zokupakisha eziphambili. Ukuthatha ukuveliswa kwe-chip njengomzekelo, sinokubona ukuba ukusuka kwi-silicon wafer ukuya kwi-chip, kufuneka ihambe ngeenkqubo ezi-7 eziphambili zokuvelisa, ezizezi, i-diffusion (Inkqubo ye-Thermal), i-Photo-lithography (i-Photo-lithography), i-Etch (Etch), Ukufakelwa kwe-Ion (i-IonImplant), i-Thin Film Growth (i-Dielectric Deposition), i-Chemical Mechanical Polishing (CMP), i-Metalization (i-Metalization) Iinkqubo zihambelana enye enye. Ithagethi ye-sputtering isetyenziswa kwinkqubo ye-"metallization". Ithagethi ibethelwa ngamasuntswana anamandla aphezulu ngesixhobo sokubekwa kwefilim ebhityileyo kwaye emva koko umaleko wesinyithi onemisebenzi ethile yakhelwe kwi-silicon wafer, efana ne-conductive layer, i-barrier layer. Yima.Ekubeni iinkqubo ze-semiconductors zizonke zahluka ngoko ke ezinye iimeko ziyafuneka ukuze kungqinwe ukuba isixokelelwano sikhona ngokuchanekileyo ngoko ke sifuna ezinye iintlobo zemathiriyeli ye-dummy kwinqanaba elithile lemveliso ukuze siqinisekise iziphumo.
Ixesha lokuposa: Jan-17-2022